DIE RELEASE AGENT COMPOSITION

WIPO Patent Application WO/2013/111708

A1

Provided is a die release agent composition which is used by being coated on a die used for die forging or a die used for metal squeeze casting or low-pressure casting. A die release agent composition containing: a mineral oil or a synthetic oil; a solid lubricant (for example, talc, boron nitride, black lead, mica, or molybdenum disulfide which preferably have an average particle diameter between 0.5 and 30 μm and of which the content is between 1 and 10 mass%); a thermosetting resin (various resins such as melamine resin, urea resin, and phenol resin having different average molecular weights can be selected and used depending on the necessary adhesive force); and a polymer compound (for example, a synthetic wax or polybutene). Said die release agent is used by being coated on the inner surface of a die for casting or forging.

SUZUKI MIKINORI (JP)
OSHIMOTO YASUNARI (JP)
MATSUKI TAMOTSU (JP)
SAKOU SHIGERU (JP)
ISHIGURO MASAAKI (JP)
MORI MASASHI (JP)
UESAKA NAOTO (JP)
YASUDA KAZUMASA (JP)
MOROOKA MASAYOSHI (JP)

PCT/JP2013/051106

August 01, 2013

January 21, 2013

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YUSHIRO CHEM IND (JP)
DENSO CORP (JP)

B22C3/00; B21J3/00; C10M125/02; C10M125/22; C10M125/26; C10M125/30; C10M143/06; C10M145/20; C10M145/22; C10M149/20; C10M159/06

JP2009166093A	2009-07-30
JP2008093722A	2008-04-24
JP2007144499A	2007-06-14
JP2006212691A	2006-08-17
JP2003275845A	2003-09-30
JP2003048218A	2003-02-18
JPH1177234A	1999-03-23
JPH09276981A	1997-10-28

KOJIMA SEIJI (JP)
Seiji Kojima (JP)

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