Title:
DIELECTRIC-HEATING BONDING FILM AND BONDING METHOD USING DIELECTRIC-HEATING BONDING FILM
Document Type and Number:
WIPO Patent Application WO/2018/079355
Kind Code:
A1
Abstract:
Provided are: a prescribed dielectric-heating bonding film that can achieve favorable bonding to different types of adherends even by means of a short dielectric heating treatment; and a bonding method that uses the dielectric-heating bonding film. A dielectric-heating bonding film that is for bonding a pair of adherends that comprise the same or different materials by means of a dielectric heating treatment. The dielectric-heating bonding film contains: as an A1 component, a first thermoplastic resin that has a prescribed solubility parameter (δ1); as an A2 component, a second thermoplastic resin that has a larger solubility parameter (δ2) than the first thermoplastic resin; and, as a B component, a dielectric filler. A bonding method that uses the dielectric heating bonding film.
Inventors:
ISHIKAWA MASAKAZU (JP)
Application Number:
PCT/JP2017/037617
Publication Date:
May 03, 2018
Filing Date:
October 18, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/00; B29C65/04; B29C65/50; C09J11/04; C09J123/00; C09J123/10; C09J167/00; C09J201/00; H05B6/46; H05B6/64
Foreign References:
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| JP2000289113A | 2000-10-17 | |||
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| JPS544933A | 1979-01-16 | |||
| JPH0848824A | 1996-02-20 | |||
| JP2001146524A | 2001-05-29 | |||
| JPH08258173A | 1996-10-08 | |||
| JP2014037489A | 2014-02-27 | |||
| JPH0872055A | 1996-03-19 | |||
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| JP2014037489A | 2014-02-27 |
Other References:
See also references of EP 3533849A4
Attorney, Agent or Firm:
EMORI Kenji (JP)
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