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Patent Searching and Data


Title:
DIGITAL RECORD SYSTEM FOR DIE OR MOLD
Document Type and Number:
WIPO Patent Application WO/2017/187869
Kind Code:
A1
Abstract:
A problem to be solved by the present invention is to provide a digital record system for die or mold which is capable of operating a system without being dependent upon a particular communication environment. Provided is a digital record system for die or mold, comprising: a database (10) which stores function modules which are necessary to collect fault information which relates to a die or mold, and which accumulates the fault information; and a tablet (20), further comprising a digital record application for collecting, using the function modules, the fault information which relates to the die or mold, said tablet downloading the function modules from the database (10) via Wi-Fi, and collecting and storing in an offline state the fault information by way of the digital record application, which uses the downloaded function applications. The system transmits the fault information to the database (10) when communication via Wi-Fi is possible between the database (10) and the tablet (20).

Inventors:
INOSE HIROYUKI (JP)
AOKI TATSUYA (JP)
SUZUKI JOTARO (JP)
SATO SEIKI (JP)
Application Number:
PCT/JP2017/012816
Publication Date:
November 02, 2017
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
KNOWLEDGE MFG COMPANY (JP)
International Classes:
G05B19/418; B21D37/20; B29C33/70; G06Q50/04
Foreign References:
JP2015179348A2015-10-08
JP2012168606A2012-09-06
JP2012248157A2012-12-13
JP2009282822A2009-12-03
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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