Title:
DIMER-CONTAINING POLYAMIDE RESIN AND RESIN COMPOSITION OF SAME
Document Type and Number:
WIPO Patent Application WO/2017/033956
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin composition which exhibits good adhesion to a copper surface, a polyimide surface and a gold-plated surface, while having excellent adhesiveness after heat resistance test and after wet heat resistance test; and a polyamide resin which is useful for this resin composition. The description of the present invention discloses a resin composition which contains (A) a polyamide resin that contains, in the main chain skeleton, a divalent linking group formed by removing two carboxyl groups from a dimer acid that is a dimer of an unsaturated aliphatic monocarboxylic acid having 8-22 carbon atoms and/or a divalent linking group formed by removing two amino groups from a dimer amine that is a dimer of an unsaturated aliphatic monoamine having 8-22 carbon atoms, and an ether bond, and (B) an epoxy resin, and wherein: the content of the epoxy resin (B) relative to the total of the polyamide resin (A) and the epoxy resin (B) is from 1% by mass to 50% by mass; and the epoxy resin (B) contains one or more epoxy resins selected from the group consisting of epoxy resins represented by formulae (1-1) and (1-2).
Inventors:
KOUMOTO TAIHEI (JP)
SEGAWA JUNICHI (JP)
IWASAKI KOJU (JP)
SEGAWA JUNICHI (JP)
IWASAKI KOJU (JP)
Application Number:
PCT/JP2016/074603
Publication Date:
March 02, 2017
Filing Date:
August 24, 2016
Export Citation:
Assignee:
NIPPONKAYAKU KK (JP)
International Classes:
C08L77/08; B32B15/088; B32B15/092; C08G59/06; C08G69/34; C08G69/40; C08J5/18; C08L63/00; C09J7/00; C09J11/06; C09J163/00; C09J177/08; H05K1/03
Foreign References:
| JP2009088499A | 2009-04-23 | |||
| JP2010004067A | 2010-01-07 | |||
| JPS5061429A | 1975-05-27 | |||
| JPS5061434A | 1975-05-27 |
Attorney, Agent or Firm:
KAMIMURA Yoichiro (JP)
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