Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DIMPLE MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/049260
Kind Code:
A1
Abstract:
In a dimple machining method for forming dimples in a curved surface (41) of an object (40) to be machined, a cutting tool 1 having a cutting edge (5a) on a rod-like body (2) is rotated about an axis (2a). The object (40) to be machined is rotated about a first axis (20a). The cutting tool (1) or the object (40) to be machined is moved over a virtual plane through which the first axis (20a) passes and that is perpendicular to the Y axis or over a plane parallel to the virtual plane such that a distal end (3) of the cutting tool (1) moves over the curved surface (41) of the object (40) to be machined. The cutting edge (5a) forms a dimple in the curved surface (41) each time the cutting tool 1 is rotated.

Inventors:
SATO TOSHIKI (JP)
KANDA YASUYUKI (JP)
NIIMI TATSUYA (JP)
Application Number:
PCT/JP2020/031089
Publication Date:
March 18, 2021
Filing Date:
August 18, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KANEFUSA KNIFE & SAW (JP)
International Classes:
B23C3/16; B23C3/04; B23P15/00
Domestic Patent References:
WO2017002326A12017-01-05
Foreign References:
JPH048414A1992-01-13
JP2004201874A2004-07-22
JPH0655364A1994-03-01
US9872772B22018-01-23
Attorney, Agent or Firm:
OKADA PATENT & TRADEMARK OFFICE, P. C. (JP)
Download PDF: