Title:
DIODE PACKAGE HAVING IMPROVED LEAD WIRE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2011/162470
Kind Code:
A2
Abstract:
According to the present invention, a diode package comprises an upper lead wire (130) and a lower lead wire (140), each of which has the shape of a long flat plate and has first and second ends opposite to each other, wherein: the lower surface of the first end of the upper lead wire (130) is attached to the upper surface of a diode chip (110); the upper surface of the first end of the lower lead wire (140) is attached to the lower surface of the diode chip (110); and the second end of the upper lead wire (130) and the second end of the lower lead wire (140) are withdrawn to the outside in the lateral direction of a molding compound (120). Preferably, the upper lead wire (130) is provided at the first end thereof with a hemisphere-shaped connector (132) which is concaved from the top to form a hemispherical shape and protruded from the bottom in a hemispherical shape. In this case, a through hole (133) is formed at the center of the hemisphere-shaped connector (132).
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Inventors:
KIM JAE KU (KR)
Application Number:
PCT/KR2011/001978
Publication Date:
December 29, 2011
Filing Date:
March 23, 2011
Export Citation:
Assignee:
KIM JAE KU (KR)
International Classes:
H01L23/48; H01L33/62
Foreign References:
| JPH0982865A | 1997-03-28 | |||
| US20080224285A1 | 2008-09-18 | |||
| JPH09219481A | 1997-08-19 | |||
| JP2003347491A | 2003-12-05 |
Attorney, Agent or Firm:
PARK, JI HO (KR)
박지호 (KR)
박지호 (KR)
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Claims:
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