Title:
DIRECT PLATING METHOD AND SOLUTION FOR PALLADIUM CONDUCTOR LAYER FORMATION
Document Type and Number:
WIPO Patent Application WO/2008/056403
Kind Code:
A1
Abstract:
A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper. Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high.
Inventors:
YAMAMOTO HISAMITSU (JP)
Application Number:
PCT/JP2006/322117
Publication Date:
May 15, 2008
Filing Date:
November 06, 2006
Export Citation:
Assignee:
UYEMURA C & CO LTD (JP)
YAMAMOTO HISAMITSU (JP)
YAMAMOTO HISAMITSU (JP)
International Classes:
C25D5/54; C25D5/56
Foreign References:
| JPH07263843A | 1995-10-13 | |||
| JP2006219757A | 2006-08-24 | |||
| JP2001214278A | 2001-08-07 | |||
| JP2001339142A | 2001-12-07 | |||
| JP2660002B2 | 1997-10-08 | |||
| JP2799076B2 | 1998-09-17 | |||
| JP3117216B2 | 2000-12-11 | |||
| JP3284489B2 | 2002-05-20 | |||
| JP3261569B2 | 2002-03-04 |
Other References:
CHIANG Y.-Y. ET AL.: "Formation of PdS Compounds in Direct Metallization via Pd/Sn Catalyst Activation", J. ELECTROCHEM. SOC., vol. 146, no. 9, 1999, pages 3255 - 3258, XP003022614
See also references of EP 2080822A4
See also references of EP 2080822A4
Attorney, Agent or Firm:
KOJIMA, Takashi (16-12 Ginza 2-chome,Chuo-k, Tokyo 61, JP)
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