Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DISPERSIBLE CARRIER-ENCLOSING FLOW PIPE, PROCESSING DEVICE THEREFOR, AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/081091
Kind Code:
A1
Abstract:
Disclosed are a dispersible carrier-enclosing flow pipe, a processing device therefor, and a processing method, wherein, when a carrier which can target, bind or react is enclosed in a flow pipe, it is possible to efficiently perform treatments, such as reaction and wash treatments, by means of the optimal reactivity and by increasing the uniformity of encounters between a target and the carrier in a liquid as a consequence of suspending or dispersing the carrier in a sucked liquid. A dispersible carrier-enclosing flow pipe is configured to have: a flow pipe through the inside of which and at least in one direction a liquid can flow; a carrier enclosing section disposed so as to partition the inside of the flow pipe into an upstream side and a downstream side; a plurality of dispersible carriers which can absorb, bind with, capture, or react with a biological substance or a living body which were enclosed in the carrier enclosing section in a suspendable or dispersible manner by means of the liquid flow; and a turbulence generating member which is disposed in the vicinity of the upstream side boundary of the carrier enclosing section when a liquid is being introduced to the carrier enclosing section, and which can generate turbulence for dispersing the carrier.

Inventors:
TAJIMA HIDEJI (JP)
Application Number:
PCT/JP2010/073348
Publication Date:
July 07, 2011
Filing Date:
December 24, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UNIVERSAL BIO RESEARCH CO LTD (JP)
TAJIMA HIDEJI (JP)
International Classes:
G01N30/00; C12M1/00; G01N1/00; G01N30/60; G01N35/10
Domestic Patent References:
WO2008156113A12008-12-24
Foreign References:
JP2005201700A2005-07-28
JPS6253342U1987-04-02
Attorney, Agent or Firm:
DOBASHI AKIRA (JP)
Hiroshi Tsuchihashi (JP)
Download PDF: