Title:
DISPLAY MODULE PACKAGE STRUCTURE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/176703
Kind Code:
A1
Abstract:
A display module package structure (1) and a display device. The display module package structure (1) comprises: a package substrate (10); a display panel (20) located on the package substrate (10); and a protective cover plate (30) connected to the package substrate (10) by means of a stress absorbing gel (40). The package substrate (10), the stress absorbing gel (40), and the protective cover plate (30) define a closed space. The space is located between the package substrate (10) and the protective cover plate (30). The display panel (20) is located in the space. When the temperature changes, the stress absorbing gel (40) is adapted to absorb the thermal stress.
Inventors:
CHIEN CHUNG-KUANG (CN)
Application Number:
PCT/CN2017/094554
Publication Date:
October 04, 2018
Filing Date:
July 26, 2017
Export Citation:
Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
G02F1/1333; H01L51/56; H05B33/04
Domestic Patent References:
| WO2016145651A1 | 2016-09-22 |
Foreign References:
| CN104641280A | 2015-05-20 | |||
| CN1531116A | 2004-09-22 | |||
| CN102782871A | 2012-11-14 | |||
| CN204926031U | 2015-12-30 | |||
| CN101348701A | 2009-01-21 | |||
| CN102086365A | 2011-06-08 | |||
| CN106842648A | 2017-06-13 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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