Title:
DISPLAY SUBSTRATE, CHIP-ON-FILM, DISPLAY DEVICE AND FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/196898
Kind Code:
A1
Abstract:
Provided in the present application are a display substrate, a chip-on-film (COF), a display device and a fabrication method therefor. The display device comprises: a base substrate, a binding structure, and a COF; the binding structure is located on the substrate; the COF and one side of the binding structure far from the base substrate are clamped to one another and bound to one another; and when the COF is bound to the binding structure, the COF makes contacts with both a first surface and a second surface of the side of the binding structure far from the base substrate, the first surface being parallel to the base substrate, and the second surface having an included angle with the first surface.
Inventors:
SHUI YUDAN (CN)
REN YANPING (CN)
XIANG LIAN (CN)
REN YANPING (CN)
XIANG LIAN (CN)
Application Number:
PCT/CN2021/075948
Publication Date:
October 07, 2021
Filing Date:
February 08, 2021
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
H01L27/32; H01L21/77; G09F9/33; G09G3/3225
Foreign References:
| CN111430421A | 2020-07-17 | |||
| CN106783880A | 2017-05-31 | |||
| CN110867462A | 2020-03-06 | |||
| CN110828480A | 2020-02-21 | |||
| CN110888276A | 2020-03-17 | |||
| CN107039377A | 2017-08-11 | |||
| JP2019101224A | 2019-06-24 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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