Title:
DISTANCE MEASUREMENT SENSOR, DISTANCE MEASUREMENT SYSTEM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/080128
Kind Code:
A1
Abstract:
The present technology relates to: a distance measurement sensor with which it is possible to efficiently arrange circuits that realize distance measurement by means of differing distance measurement schemes; a distance measurement system; and an electronic device. The distance measurement sensor comprises: a light emission control circuit that generates a light emission pulse for controlling the light emission timing of emitted light; a pixel modulation unit that performs charge distribution control in a pixel by an indirect ToF scheme; and a TDC that generates a count value corresponding to the time-of-flight of the emitted light by a direct ToF scheme, wherein the light emission control circuit is arranged adjacently to the pixel modulation unit and the TDC. The present technology can be applied to, for example, a distance measurement sensor that measures the distance to a subject.
Inventors:
MORIYAMA YUSUKE (JP)
MAHARA KUMIKO (JP)
OZAWA OSAMU (JP)
MAHARA KUMIKO (JP)
OZAWA OSAMU (JP)
Application Number:
PCT/JP2021/035517
Publication Date:
April 21, 2022
Filing Date:
September 28, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G01S7/484; G01S7/4863; G01S17/894; H01L27/146; H04N5/3745
Domestic Patent References:
| WO2019123831A1 | 2019-06-27 |
Foreign References:
| US20200174105A1 | 2020-06-04 | |||
| JP2020148562A | 2020-09-17 | |||
| JP2019191018A | 2019-10-31 |
Other References:
OKINO, T . ET AL.: "5.2 A 1200x900 6µm 450fps Geiger-Mode Vertical Avalanche Photodiodes CMOS Image Sensor for a 250m Time-of-Flight Ranging System Using Direct-Indirect-Mixed Frame Synthesis with Configurable-Depth-Resolution Down to 10cm", 2020 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC, 17 February 2020 (2020-02-17), pages 96 - 98, XP033754458, DOI: 10.1109/ ISSCC19947.2020.9063045
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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