Title:
DOOR ASSEMBLY FOR SEMICONDUCTOR WAFER MANUFACTURING
Document Type and Number:
WIPO Patent Application WO1999043582
Kind Code:
A8
Abstract:
An automated door assembly (18) is provided for sealing an opening (12) in a barrier (17) to a contaminant-free environment suitable for semiconductor wafer processing. The door assembly (18) comprises a base (16) pivotable toward and away from the opening (12) along an arcuate path and a closure plate (10) linearly movably coupled to the base (16) and configured to a seal the opening (12) in the barrier (17). The closure plate (10) is movable in synchonization with the pivoting of the base to traverse a horizontal linear path into contact with the barrier to close the opening (17). A sensor (60) disposed on the closure plate (10) is operable to sense the position of wafers (64) or other objects disposed adjacent the opening, to detect misalignment or omission thereof. A latch (44) and latching apparatus for latching a wafer pod (38) or cassette is also provided. The latching apparatus includes a pod support (50) and a platform (36) linearly movably coupled to the pod support.
Inventors:
DENKER JEFFREY M
Application Number:
PCT/US1999/004307
Publication Date:
November 04, 1999
Filing Date:
February 26, 1999
Export Citation:
Assignee:
PRI AUTOMATION INC (US)
International Classes:
B65G49/02; B65G49/07; H01L21/00; (IPC1-7): B65G49/07
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