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Patent Searching and Data


Title:
DOUGH COMPOSITION FOR SUGARLESS BREAD, SUGARLESS BREAD AND PROCESSES FOR MAKING THEM
Document Type and Number:
WIPO Patent Application WO/2014/157837
Kind Code:
A1
Abstract:
Provided are a dough composition for sugarless bread, sugarless bread and a processes for making them, which can reduce sugar content in baking bread without sugar added, therey lowering the intake of sugar, which may cause disease such as diabetes or obesity. The dough composition for sugarless bread includes (A) 0.1 to 1.1 parts by weight of an improver, (B) 15 to 50 parts by weight of a grain mixture, and (C) 1.0 to 2.5 parts by weight of yeast, based on 100 parts by weight of flour of the dough composition. The present invention can provide sugarless bread with low sugar content by suppressing sugar from being generated during the baking process. Since the sugarless bread according to the present invention lowers the intake of sugar, which may cause diseases such as diabetes or obesity.

Inventors:
PARK CHUNG KIL (KR)
LEE CHEON YONG (KR)
OH SHIN HAK (KR)
LEE JONG HYUK (KR)
KIM BYEONG CHEOL (KR)
Application Number:
PCT/KR2014/001267
Publication Date:
October 02, 2014
Filing Date:
February 17, 2014
Export Citation:
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Assignee:
PARIS CROISSANT CO LTD (KR)
International Classes:
A21D8/02; A21D10/00
Foreign References:
KR19980021595A1998-06-25
US5700511A1997-12-23
KR20080010602A2008-01-31
KR20090044290A2009-05-07
Attorney, Agent or Firm:
SUH, Man Kyu et al. (114 Yeoksam-ro Gangnam-gu,Seoul, Seoul 135-936, KR)
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