Title:
DRY THERMAL INTERFACE MATERIAL
Document Type and Number:
WIPO Patent Application WO2003024724
Kind Code:
B1
Abstract:
A thermal interface material including a compound which has high thermal conductivity, is dry-to-the-touch, but naturally tacky, and may be formed into various shapes, such as sheets and blocks, to serve as a heat transfer material for electronic components. The compound includes a pre-blend of a polyol ester and an antioxidant, a filler(s), a high viscosity oil, and either a solvent, a surfactant, and a polystyrene-based polymer, or aluminum silicate. A method for using the compound includes the steps of providing a heat generating electronic component with a first surface; providing a heat dissipating component with a second surface with which the first surface is to interface; and disposing the compound between the respective surfaces to effectuate efficient heat transfer therebetween. Further, the compound can be applied alone, e.g., layered, sprayed, or screen printed, can be applied to a thermally conductive foil backing, or a thermally conductive and electrically insulative backing, or formed into shapes such as blocks or sheets. Also, removable liners can be applied to exposed surfaces of the compound to facilitate handling, shipping and storage, but are removed prior to the compound being applied between the electronic component and the heat sink.
More Like This:
Inventors:
KHATRI PRAKASH
Application Number:
PCT/US2002/029044
Publication Date:
September 04, 2003
Filing Date:
September 13, 2002
Export Citation:
Assignee:
AOS THERMAL COMPOUNDS (US)
International Classes:
C08K3/00; C08K5/103; F28F1/32; C08L101/00; C09K5/08; C09K5/14; F28F13/00; H01L23/373; H05K7/20; (IPC1-7): C09K5/14; H01L23/373
Download PDF: