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Patent Searching and Data


Title:
DRYING APPARATUS AND DRYING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/192685
Kind Code:
A1
Abstract:
The present invention improves drying uniformity. A drying apparatus (1A) is provided with: a condenser plate (11) that faces a coating film on a substrate (f1) to be transferred, and dries said coating film by condensing solvent vapor from the coating film; and one or a plurality of heating devices (12) that is disposed at a position facing the condenser plate (11) with the substrate (f1) therebetween, and heats the substrate (f1). The drying apparatus (1A) is heated by the heating device/devices (12) in such a manner that the temperature of the coating film on the substrate (f1) gradually rises. The one or plurality of heating devices (12) is disposed at an inclination to the substrate surface in such a manner that the distance between the heating device/devices (12) and the substrate (f1) gradually decreases in the transfer direction (y) of the substrate (f1).

Inventors:
KURAKATA SHINICHI (JP)
HIROSE TATSUYA (JP)
Application Number:
PCT/JP2014/063814
Publication Date:
December 04, 2014
Filing Date:
May 26, 2014
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
International Classes:
F26B13/10; B05C9/14; B05D3/02; B05D7/24; F26B3/28
Foreign References:
JP4631242B22011-02-23
JP2009099835A2009-05-07
JP2004235181A2004-08-19
JPS3418382Y1
JP2012250181A2012-12-20
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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