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Patent Searching and Data


Title:
DUAL-PATH LASER ASSISTED MACHINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/022072
Kind Code:
A1
Abstract:
The present invention provides a dual-path laser assisted machining system, comprising: a cutter, a first laser light emitting device, and a second laser light emitting device, wherein the first laser light emitting device can emit laser light to a surface to be machined of a workpiece and form a first irradiated area; the second laser light emitting device can emit laser light to said surface of the workpiece and form a second irradiated area; the first irradiated area and the second irradiated area have an overlapping area; a machining point of the cutter on said surface falls within the overlapping area; and the included angle between the projection of the line connecting the first laser light emitting device and the cutter on said surface and the projection of the line connecting the second laser light emitting device and the cutter on said surface is not equal to 0°. According to the dual-path laser assisted machining system disclosed by the present invention, two laser light generating devices are provided, and two laser light irradiated areas are overlapped and complementary, so that the blind area is greatly reduced, so as to achieve softening of an area to be machined and complete high-precision machining of a brittle material.

Inventors:
YU BENHONG (CN)
REN ZHIHUI (CN)
JING CHUANSI (CN)
ZHANG JINGMING (CN)
JIANG QIUYU (CN)
LIU JINGWEN (CN)
Application Number:
PCT/CN2023/105991
Publication Date:
February 01, 2024
Filing Date:
July 06, 2023
Export Citation:
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Assignee:
KEDE NUMERICAL CONTROL CO LTD (CN)
International Classes:
B23C1/06; B23C9/00; B23Q17/24
Foreign References:
US20160101492A12016-04-14
CN115383189A2022-11-25
CN107378235A2017-11-24
CN114311343A2022-04-12
CN114571064A2022-06-03
CN112743297A2021-05-04
CN113369996A2021-09-10
JP2009226475A2009-10-08
Attorney, Agent or Firm:
DALIAN ZHICHENG PATENT AGENCY (CN)
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