DUCTILITY AGENTS FOR NICKEL-TUNGSTEN ALLOYS

WIPO Patent Application WO1999049107

A3

A tungsten alloy electroplating bath. Highly ductile tungsten alloy deposits are facilitated using a sulfur co-depositing ductility additive such as: (a) or (b) or (c), wherein R1 is selected from the group consisting of H, alkyl, alkenyl, hydroxy, halogen, carboxy and carbonyl; "AR" designates a benzene or naphthalene moiety; R2 is selected from the group consisting of H, or an alkyl sulfonic acid, a Group I or Group II salt of an alkyl sulfonic acid, a benzene, a sulfonate, a naphthalene sulfonate, a benzene sulfonamide, a naphthalene sulfonamide, an ethylene alkoxy, a propylene alkoxy; and R2 may be attached to "AR" to form a cyclic moiety; and R3 is selected from the group consisting of a benzene, a naphthalene, an unsaturated aliphatic group; and a benzenesulfonate group. The additive provides ductility improvements in tungsten alloy electroplates deposited from the solution.

RODRIGUEZ DANIELLE

PCT/US1999/006322

December 23, 1999

March 23, 1999

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ENTHONE OMI INC (US)

C25D3/56; (IPC1-7): C25D3/56

US4525248A	1985-06-25
GB2033430A	1980-05-21
US5525206A	1996-06-11

ATANASSOV N ET AL: "KINETICS OF ELECTRODEPOSITION AND PROPERTIES OF NICKEL-TUNGSTEN ALLOYS", TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, vol. 76, no. PART 01, 1 January 1998 (1998-01-01), pages 39/40, XP000734485, ISSN: 0020-2967
HUANG C -H: "A STUDY OF THE EFFECTS OF DIAMMONIUM CITRATE ON ELECTROFORMED NICKEL-TUNGSTEN ALLOY", PLATING AND SURFACE FINISHING, vol. 84, no. 4, 1 April 1997 (1997-04-01), pages 62 - 65, XP000700592, ISSN: 0360-3164

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