DUST REMOVING MATERIAL AND DUST REMOVAL METHOD USING SAME

WIPO Patent Application WO/2011/111416

A1

Disclosed are: a dust removing material, which is capable of surely capturing and removing the dust that adheres to a recessed and projected surface of an object of dust removal such as the surface of a microlens, and which is free from transfer of a resin or other components thereof to the recessed and projected surface; and a dust removal method using the dust removing material. Specifically disclosed is a dust removing material (1) wherein a hot melt layer (3) is formed on the surface of a plastic film (2) that serves as a supporting body. The hot melt layer (3) is bonded to a recessed and projected surface (11) of an object of dust removal by thermocompression and then cooled, thereby removing the dust adhering to the recessed and projected surface. The hot melt layer (3) is composed of a thermoplastic resin layer that contains a thermoplastic resin having a softening temperature within the range of 110-170˚C or a plurality of kinds of thermoplastic resins having different softening temperatures. At the time of dust removal, the hot melt layer (3) of the dust removing material (1) is bonded to the recessed and projected surface (11) by thermocompression at a temperature not higher than the softening temperatures of the thermoplastic resins, and then cooled, and subsequently the dust removing material (1) is separated from the recessed and projected surface (11).

SHINYA YOSHIHISA (JP)
UCHIDA HIROSHI (JP)

PCT/JP2011/050580

September 15, 2011

January 14, 2011

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SONY CHEM & INF DEVICE CORP (JP)
SHINYA YOSHIHISA (JP)
UCHIDA HIROSHI (JP)

B08B7/00; A47L25/00

WO2000057765A1

2000-10-05

JP2005237447A	2005-09-08
JPH11143320A	1999-05-28

KOIKE, Akira et al. (JP)
Akira Koike (JP)

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