DYNAMIC-QUANTITY MEASUREMENT DEVICE AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2014/156273

A1

The present invention proposes a join structure that: optimizes a join between a base substrate and a sensor chip that has a strain detection unit on a semiconductor substrate; allows strain in an object being measured to be detected with high sensitivity even under high temperatures; and allows accurate sensor output even when subjected to strain for a long period of time. To that end, this dynamic-quantity measurement device is characterized by having the following: a sensor chip that has, on a semiconductor substrate, a strain detection unit that detects in-plane expansion and contraction; a base substrate; and a wiring part via which an electrode on the sensor chip is wired to the outside. This dynamic-quantity measurement device is also characterized in that the bottom surface of the sensor chip, opposite the surface thereof where the strain detection unit is provided, is joined to the top surface of the base substrate with an intermetallic-compound layer and a high-melting-point metal layer interposed therebetween.

SHIMOKAWA HANAE (JP)
YAMAGUCHI TAKUTO (JP)
HATA SHOHEI (JP)
OOTA HIROYUKI (JP)

PCT/JP2014/051822

October 02, 2014

January 28, 2014

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HITACHI LTD (JP)

G01L1/18; G01B7/16; G01L9/00

JP2009053005A	2009-03-12
JP2006237215A	2006-09-07
JP2012169524A	2012-09-06
JPH04232824A	1992-08-21

POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)

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