Title:
EARPHONE AND EARPHONE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2023/246726
Kind Code:
A1
Abstract:
Disclosed in the present application are an earphone and an earphone assembly. The earphone comprises a housing, a first circuit board, and an antenna; the first circuit board and the antenna are both located in the housing and are arranged in a stacked manner; the first circuit board and the antenna are structural parts independent of each other; the first circuit board is located between the antenna and the housing; a touch sensor is provided on the side of the first circuit board facing the housing; the touch sensor is used for detecting a touch action acting on the housing; and the antenna is used for receiving and transmitting a radio-frequency signal. The antenna of the earphone can provide a reference ground for the touch sensor, and the touch sensor and the antenna coexist in a same space region, thereby minimizing the occupied space, and facilitating the miniaturization of the earphone.
Inventors:
DONG LI (CN)
Application Number:
PCT/CN2023/101202
Publication Date:
December 28, 2023
Filing Date:
June 20, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H04R1/10
Foreign References:
| CN216626024U | 2022-05-27 | |||
| CN213342621U | 2021-06-01 | |||
| US20220103925A1 | 2022-03-31 | |||
| CN210272654U | 2020-04-07 | |||
| CN209994534U | 2020-01-24 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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