Title:
EARPHONE
Document Type and Number:
WIPO Patent Application WO/2024/053335
Kind Code:
A1
Abstract:
[Problem] To provide an earphone that offers high sound quality while reducing pressure on a diaphragm. [Solution] An earphone 1 comprises: a diaphragm 6; a driver unit 5 with the diaphragm located on the front surface thereof; a unit cap 2 that accommodates the driver unit; and an acoustic tube 3 that is coupled to the front surface of the unit cap and forms a front-side air chamber on the front surface of the diaphragm. The unit cap comprises: a unit holding wall 21 that holds the side wall of the driver unit; and a communication hole 22 that provides communication, in front of the unit holding wall, between the inside and the outside of the unit holding wall, and between the front surface and the back surface of the unit cap. The central axis of a unit accommodation part 21a defined by the unit holding wall is offset from the central axis of the unit cap.
Inventors:
FUKUSHIMA SHIWAKU NONOMI (JP)
OZAWA HIROMICHI (JP)
OZAWA HIROMICHI (JP)
Application Number:
PCT/JP2023/029306
Publication Date:
March 14, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
AUDIO TECHNICA KK (JP)
International Classes:
H04R1/10
Foreign References:
| JP2019033365A | 2019-02-28 | |||
| JP2015109542A | 2015-06-11 | |||
| JP2017158045A | 2017-09-07 |
Attorney, Agent or Firm:
KASUKAWA Toshio (JP)
Download PDF: