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Patent Searching and Data


Title:
EARPHONES
Document Type and Number:
WIPO Patent Application WO/2023/245612
Kind Code:
A1
Abstract:
The present application mainly relates to earphones, each comprising a support assembly and a core module connected to the support assembly. The support assembly is used for supporting the core module to be worn to a wearing position; the core module comprises a core housing, a transducer device, and a vibration panel; the transducer device is disposed in an accommodating cavity of the core housing; and the vibration panel is connected to the transducer device and is used for transmitting, to a user, mechanical vibration generated by the transducer device. The core module further comprises an auxiliary structure connected to the vibration panel; and the auxiliary structure is configured such that a first frequency response curve of vibration of the vibration panel in a non-wearing state has a first resonance valley within a target frequency range. According to the earphones provided by the present application, the auxiliary structure is connected to the vibration panel, and the vibration of the vibration panel within the target frequency range is weakened by means of resonance of the auxiliary structure, thereby adjusting the vibration amplitude of the vibration panel within the target frequency range, and adjusting the frequency response curve of the vibration of the vibration panel.

Inventors:
FU JUNJIANG (CN)
Application Number:
PCT/CN2022/101073
Publication Date:
December 28, 2023
Filing Date:
June 24, 2022
Export Citation:
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Assignee:
SHENZHEN SHOKZ CO LTD (CN)
International Classes:
H04R1/28
Foreign References:
CN214708013U2021-11-12
CN1675846A2005-09-28
CN105101020A2015-11-25
CN112751544A2021-05-04
CN115334435A2022-11-11
JP2007150871A2007-06-14
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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