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Title:
EASILY DETACHABLE THERMOSETTING RESIN COMPOSITION AND DETACHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/234340
Kind Code:
A1
Abstract:
An easily detachable thermosetting resin composition according to the present invention contains a thermosetting component; and a cured product which is obtained by thermally curing this thermosetting resin composition has a structure represented by formula (1).

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Inventors:
MAKIHARA KOJI (JP)
KUMAMOTO TSUNEAKI (JP)
HASHIZUME MASAYOSHI (JP)
Application Number:
PCT/JP2023/020245
Publication Date:
December 07, 2023
Filing Date:
May 31, 2023
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L101/06; C08G59/40; H01L23/29; H01L23/31
Foreign References:
JP2022032813A2022-02-25
JPH02147619A1990-06-06
JP2008156475A2008-07-10
JP2022183437A2022-12-13
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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