Title:
EASILY DISINTEGRABLE ADHESIVE MATERIAL, ARTICLE AND DISINTEGRATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/251099
Kind Code:
A1
Abstract:
This easily disintegrable adhesive material contains a thermosetting resin and thermally expandable particles. The thermosetting resin contains an epoxy resin and a curing component that contains one or both of a curing agent and a curing accelerator. The thermosetting resin contains a thermally disintegrable compound having a thermally disintegrable structure in the manner described in either (i) or (ii). (i) In a case where the curing component contains a curing agent, one or both of the epoxy resin and the curing agent contain(s) the thermally disintegrable compound. (ii) In a case where the curing component does not contain a curing agent, the epoxy resin contains the thermally disintegrable compound.
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Inventors:
SATO ERIKO (JP)
Application Number:
PCT/JP2021/019201
Publication Date:
December 16, 2021
Filing Date:
May 20, 2021
Export Citation:
Assignee:
UNIV KYUSHU NAT UNIV CORP (JP)
International Classes:
C09J5/00; C09J11/06; C09J163/00
Foreign References:
| JP2003183348A | 2003-07-03 | |||
| JP2002293861A | 2002-10-09 | |||
| JP2006225544A | 2006-08-31 | |||
| JP2003286464A | 2003-10-10 | |||
| JP2003171648A | 2003-06-20 | |||
| JP2002187973A | 2002-07-05 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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