Title:
EASY-HEAT-DISASSEMBLY ADHESIVE COMPOSITION OR THERMALLY DECOMPOSABLE BINDER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/013678
Kind Code:
A1
Abstract:
The present invention addresses the problem of developing a binder or an adhesive having superior easy-disassembly properties or decomposition properties while having sufficient adhesiveness prior to being heated. The above problem is solved by an easy-heat-disassembly adhesive composition or a thermally decomposable binder composition containing a (meth)acrylic-acid-ester-based polymer that includes a (meth)acrylic-acid-ester-based monomer unit having a tertiary alkoxycarbonyloxy group at a terminal, and a thermal acid generator.
Inventors:
MATSUMOTO AKIKAZU (JP)
Application Number:
PCT/JP2022/029807
Publication Date:
February 09, 2023
Filing Date:
August 03, 2022
Export Citation:
Assignee:
UNIV OSAKA PUBLIC CORP (JP)
International Classes:
C09J11/06; C09J133/14
Domestic Patent References:
| WO2016121815A1 | 2016-08-04 |
Foreign References:
| JP2019210405A | 2019-12-12 | |||
| JP2020012013A | 2020-01-23 | |||
| JP2007186607A | 2007-07-26 | |||
| JP2015007189A | 2015-01-15 | |||
| JP2004043732A | 2004-02-12 | |||
| JP2015007190A | 2015-01-15 | |||
| JP2019167465A | 2019-10-03 | |||
| JP2015189883A | 2015-11-02 |
Attorney, Agent or Firm:
NOGAWA, Shintaro et al. (JP)
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