Title:
EDDY CURRENT-TYPE MOLD LEVEL MEASUREMENT DEVICE AND MOLD LEVEL MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2016/017028
Kind Code:
A1
Abstract:
Provided is an eddy current-type mold level measurement device which has sufficiently high accuracy and which can handle dynamic disturbance factors. This eddy current-type mold level measurement device measures the level of molten metal in a mold, and is provided with: a detection unit having a coil for detecting change in the impedance value, which depends on change in the mold level; an amplification unit which amplifies output of the detection unit; and a mold oscillation calibration unit which calibrates the positive feedback rate of the amplification unit such that during mold oscillation, the difference between the maximum value and the minimum value of the output of said measurement device exhibits the amplitude value of the mold oscillation.
Inventors:
KOYAMA FUMIO (JP)
Application Number:
PCT/JP2014/070340
Publication Date:
February 04, 2016
Filing Date:
August 01, 2014
Export Citation:
Assignee:
NIRECO CORP (JP)
International Classes:
G01F23/26; B22D11/16
Foreign References:
| JPS60216959A | 1985-10-30 | |||
| JPS63111248U | 1988-07-16 | |||
| JP2007021529A | 2007-02-01 | |||
| JP5463440B1 | 2014-04-09 |
Attorney, Agent or Firm:
FUSHIMI, NAOYA (JP)
Naoya Fushimi (JP)
Naoya Fushimi (JP)
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