Title:
ELASTIC WAVE APPARATUS AND METHOD FOR MANUFACTURING ELASTIC WAVE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/013694
Kind Code:
A1
Abstract:
The present invention addresses the problem of suppressing variation in chip size. This elastic wave apparatus comprises: a first substrate; a piezoelectric layer that overlaps the first substrate as seen in a first direction and has a first main surface and a second main surface on the opposite side from the first main surface; a functional electrode provided to at least one of the first main surface and the second main surface of the piezoelectric layer; a second surface facing the first main surface of the piezoelectric layer in the first direction; and a support supporting the second substrate between the first main surface of the piezoelectric layer and the second substrate. The second substrate is smaller than the first substrate as seen in the first direction, the contour of the second substrate is on the inside of the contour of the first substrate as seen in the first direction, and, as seen in a planar direction orthogonal to the first direction, an end surface of at least one contour of the piezoelectric layer on the second substrate side of the first substrate, a metal on the outside of the piezoelectric layer, and a silicon nitride on the outside of the piezoelectric layer, is at least partially exposed.
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Inventors:
YAMANE TAKASHI (JP)
KAI SEIJI (JP)
KAI SEIJI (JP)
Application Number:
PCT/JP2022/029841
Publication Date:
February 09, 2023
Filing Date:
August 03, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2021060513A1 | 2021-04-01 |
Foreign References:
| JP2012029134A | 2012-02-09 | |||
| US20170063335A1 | 2017-03-02 | |||
| JP2020191597A | 2020-11-26 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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