Title:
ELASTIC WAVE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/118970
Kind Code:
A1
Abstract:
The present invention reduces stress at the end of an electrode on a piezoelectric layer side. This elastic wave apparatus comprises: a support substrate; a piezoelectric layer having a first major surface and a second major surface; and at least a pair of functional electrodes which comprise a first electrode major surface and a second electrode major surface, oppose each other in a second direction, and are provided adjacent to each other on the first major surface. A cavity provided in a part of the support substrate or an air gap provided between the support substrate and the piezoelectric layer provides a cavity portion. The cavity portion, when viewed in plan from a first direction, overlaps at least a part of the functional electrodes. The functional electrodes further comprise a first side surface and a second side surface, which are two side surfaces connecting the first electrode major surface and the second electrode major surface. The first side surface includes a first part having a first angle which is an angle between the first side surface and the first major surface, and a second part having a second angle which is an angle between the first side surface and the first major surface and is smaller than the first angle. The second part is provided on the piezoelectric layer side relative to the first part.
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Inventors:
YAMANE TAKASHI (JP)
Application Number:
PCT/JP2021/044556
Publication Date:
June 09, 2022
Filing Date:
December 03, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H9/25
Domestic Patent References:
| WO2012102131A1 | 2012-08-02 | |||
| WO2017013945A1 | 2017-01-26 | |||
| WO2016080444A1 | 2016-05-26 | |||
| WO2020209152A1 | 2020-10-15 |
Foreign References:
| US20200321939A1 | 2020-10-08 | |||
| JP2019213042A | 2019-12-12 | |||
| JP2010233210A | 2010-10-14 | |||
| JP2013528996A | 2013-07-11 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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