Title:
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/211097
Kind Code:
A1
Abstract:
This elastic wave device comprises: a first substrate; a piezoelectric layer stacked on a first main surface side of the first substrate; a functional electrode provided on the piezoelectric layer; a second substrate; and a third substrate. The second substrate opposes the first substrate on the first main surface side of the first substrate, with a second hollow section therebetween. The third substrate opposes the first substrate on a second main surface side of the first substrate, with a first hollow section therebetween. The elastic wave device comprises: a first support section provided between the first main surface of the first substrate and the second substrate; and a second support section provided between the first substrate and the third substrate.
Inventors:
INOUE KAZUNORI (JP)
KAI SEIJI (JP)
KAI SEIJI (JP)
Application Number:
PCT/JP2022/016877
Publication Date:
October 06, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2019124127A1 | 2019-06-27 |
Foreign References:
| JP2005130341A | 2005-05-19 | |||
| JP2013528996A | 2013-07-11 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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