Title:
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/022157
Kind Code:
A1
Abstract:
The present invention inhibits the flowing of current between extraction electrodes. This elastic wave device includes: a first substrate; a piezoelectric layer that overlaps the first substrate in a plan view and has a first main surface and a second main surface on the opposite side; a functional electrode provided to at least one among the first main surface of the piezoelectric layer and the second main surface of the piezoelectric layer; a second substrate having a first main surface facing the first main surface of the piezoelectric layer in a first direction, and a second main surface on the opposite side; and a plurality of extraction electrodes. The plurality of extraction electrodes include: a support part that supports the second substrate between the first main surface of the piezoelectric layer and the first main surface of the second substrate; a through-via penetrating through the second substrate; a first land provided to the first main surface of the second substrate and electrically connected to the through-via; and a second land provided to the second main surface of the second substrate and electrically connected to the through-via. In at least one of the extraction electrodes, there is an insulator between the first main surface of the second substrate and the first land, between the second main surface of the second substrate and the second land, and between a side wall of the through-via and the second substrate.
Inventors:
YAMANE TAKASHI (JP)
KAI SEIJI (JP)
KAI SEIJI (JP)
Application Number:
PCT/JP2022/030987
Publication Date:
February 23, 2023
Filing Date:
August 16, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145; H03H9/17
Domestic Patent References:
| WO2016159018A1 | 2016-10-06 | |||
| WO2021060522A1 | 2021-04-01 |
Foreign References:
| US20210044277A1 | 2021-02-11 | |||
| JP2011077938A | 2011-04-14 | |||
| JP2006179562A | 2006-07-06 | |||
| JP2009177736A | 2009-08-06 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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