Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/241435
Kind Code:
A1
Abstract:
Provided is an elastic wave device which can more reliably suppress diffusion of Cu into a piezoelectric substrate, the CU constituting an IDT electrode. This elastic wave device comprises: a piezoelectric substrate 2; a barrier layer 7 (outer layer) provided on the piezoelectric substrate 2; a first layer 5 (electrode layer) provided on the barrier layer 7, the main component of the first layer being Cu; and an IDT electrode 3 having a plurality of electrode fingers. The first layer 5 includes: a first principal surface 5a positioned on the piezoelectric substrate 2 side; a second principal surface 5b opposing the first principal surface 5a; and a side surface 5c connected to the first principal surface 5a and the second principal surface 5b. The barrier layer 7 covers the first principal surface 5a and the side surface 5c of the first layer 5. The thickness of the portion of the barrier layer 7 covering the first principal surface 5a of the first layer 5 is less than the thickness of the portion of the barrier layer 7 covering the side surface 5c of the first layer 5.
Inventors:
MIMURA MASAKAZU (JP)
TEGAWA SOICHIRO (JP)
TEGAWA SOICHIRO (JP)
Application Number:
PCT/JP2021/019339
Publication Date:
December 02, 2021
Filing Date:
May 21, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H9/25
Domestic Patent References:
| WO2012086639A1 | 2012-06-28 |
Foreign References:
| JP2006109287A | 2006-04-20 | |||
| JP2004289441A | 2004-10-14 | |||
| JP2010177393A | 2010-08-12 | |||
| JP2008067289A | 2008-03-21 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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