Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/102417
Kind Code:
A1
Abstract:
Provided is an elastic wave device having excellent heat dissipation. This elastic wave device 10 comprises: a support member including a support substrate 14; a piezoelectric layer 16 provided on the support member; and an IDT electrode 11 provided on a first main surface 16a of the piezoelectric layer 16, wherein the support member is provided with an air gap part 14c that is open to the piezoelectric layer 16 side, the support member 14 has an inner wall 14e facing the air gap part 14c, and a highly thermally conductive film 17 is directly or indirectly laminated on at least a portion of a second main surface 16b of the piezoelectric layer 16, and further reaches the inner wall 14e of the support member 14.
Inventors:
INOUE KAZUNORI (JP)
KUBO SHINTARO (JP)
KUBO SHINTARO (JP)
Application Number:
PCT/JP2021/039764
Publication Date:
May 19, 2022
Filing Date:
October 28, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01H11/08; G01J5/44; H01L41/047; H01L41/113; H01L41/187; H01L41/23
Domestic Patent References:
| WO2012073871A1 | 2012-06-07 |
Foreign References:
| JP2008098974A | 2008-04-24 | |||
| JP2011018675A | 2011-01-27 | |||
| JP2010220204A | 2010-09-30 | |||
| JP2010056736A | 2010-03-11 | |||
| JP2012137366A | 2012-07-19 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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