Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/085364
Kind Code:
A1
Abstract:
An elastic wave device 10 comprises: an elastic wave element 11; a bump 12 electrically connected to the elastic wave element 11; an underbump metal layer 13 provided between the elastic wave element 11 and the bump 12; a wiring substrate 14 on which the elastic wave element 11 is mounted; and an encapsulant 23 covering the elastic wave element 11 on the wiring substrate 14. The elastic wave element 11 comprises: a support substrate 16 having a dielectric layer 18 on one major surface thereof; a piezoelectric layer 19 provided on the one major surface of the support substrate 16; and a functional electrode 15 provided on at least one major surface of the piezoelectric layer 19. The wiring substrate 14 is electrically connected to the elastic wave element 11 via the underbump metal layer 13 and the bump 12. In a stacking direction of the support substrate 16 and the piezoelectric layer 19, the piezoelectric layer 19 is not provided in at least a part of a gap between the bump 12 and the support substrate 16. The thickness of the dielectric layer 18 where the piezoelectric layer 19 is not provided is more than or equal to 150 nm.
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Inventors:
YAMANE TAKASHI (JP)
Application Number:
PCT/JP2022/041929
Publication Date:
May 19, 2023
Filing Date:
November 10, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2015098679A1 | 2015-07-02 | |||
| WO2021200835A1 | 2021-10-07 |
Foreign References:
| JP2019106698A | 2019-06-27 | |||
| JP2013528996A | 2013-07-11 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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