Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/100608
Kind Code:
A1
Abstract:
The present invention provides an elastic wave device wherein capacitive coupling between an inductor and a member on which the inductor is provided can be suppressed. An elastic wave device 1 according to the present invention is provided with: a piezoelectric substrate 2 which comprises a piezoelectric layer 6; an IDT electrode 7 (a functional electrode) which is arranged on the piezoelectric layer 6; a first support layer 8 which is arranged on the piezoelectric substrate 2 so as to surround the IDT electrode 7; a cover member 12 which is arranged on the first support layer 8 and has a first main surface 12a that is positioned on the IDT electrode 7 side and a second main surface 12b that is opposite to the first main surface 12a; a silicon oxide layer 13 (an inorganic oxide layer) which is arranged on the first main surface 12a side of the cover member 12; and an inductor 14 which is composed of a wiring line and is arranged on the silicon oxide layer 13. The cover member 12 is formed of silicon. This elastic wave device 1 is additionally provided with one of an amorphous silicon layer 10 and a polysilicon layer, which is arranged between the cover member 12 and the silicon oxide layer 13.
Inventors:
YAMAZAKI SUNAO (JP)
Application Number:
PCT/JP2022/041627
Publication Date:
June 08, 2023
Filing Date:
November 09, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2021060513A1 | 2021-04-01 |
Foreign References:
| JP2017169139A | 2017-09-21 | |||
| JP2015156626A | 2015-08-27 | |||
| JP2007202130A | 2007-08-09 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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