Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286605
Kind Code:
A1
Abstract:
The present invention broadens bandwidth. An elastic wave device according to the present invention comprises: a support member having a thickness in a first direction and including a support substrate; a piezoelectric layer provided on the support member; and an IDT electrode having first electrode fingers which are provided on a main surface of the piezoelectric layer and which extend in a second direction intersecting the first direction, a first bus bar electrode to which the first electrode fingers are connected, second electrode fingers which are each opposed to one of the first electrode fingers in a third direction orthogonal to the second direction and which extend in the second direction, and a second bus bar electrode to which the second electrode fingers are connected. The support member has a space at a position which at least partially overlaps with the IDT electrode in plan view in the first direction. The first electrode fingers or second electrode fingers each have a base metal layer in contact with the piezoelectric layer and a first metal layer laminated on the base metal layer. The base metal layer contains at least one of Ni, Cr, and Ti. The piezoelectric layer has a diffusion layer containing at least one of Ni, Cr, and Ti at a position of contact with the base metal layer in the first direction.
Inventors:
KIMURA TETSUYA (JP)
Application Number:
PCT/JP2022/025955
Publication Date:
January 19, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145
Domestic Patent References:
| WO2021060513A1 | 2021-04-01 |
Foreign References:
| JP2018182499A | 2018-11-15 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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