ELECTRET BONE CONDUCTION MICROPHONE

WIPO Patent Application WO/2021/134168

A1

Provided in the present application is an electret bone conduction microphone, which comprises a housing having an accommodating space, a circuit board fixed to the housing and enclosed with the housing to form an accommodating space, and a membrane assembly, back plate and insulating spacer accommodated in the accommodating space. The insulating spacer is fixed on the side of the back plate away from the circuit board; the membrane assembly is fixed on the side of the insulating spacer away from the back plate and is disposed a distance, opposite to the back plate; an electret is provided on the surface of the back plate close to the membrane assembly. The membrane assembly comprises a conductive diaphragm and mass block; the conductive diaphragm comprises a fixing part, a folding ring surrounding the fixing part, and a supporting part surrounding the folding ring and fixed to the insulating spacer; the mass block is fixed to the fixing part and can be displaced relative to the back plate along the vibration direction of the conductive diaphragm in response to external vibration. By using a conductive diaphragm having a folding ring, the stress generated by the movement of the mass block can be effectively distributed in the entire folding ring area. Thus, the stress is more dispersed, and material fatigue, deformation or fracture do not easily occur.

ZHANG JINYU (CN)
WANG KAI (CN)

PCT/CN2019/129819

July 08, 2021

December 30, 2019

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AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)

H04R1/08; H04R7/00

CN1672456A	2005-09-21
CN201557247U	2010-08-18
CN1671252A	2005-09-21
CN201118978Y	2008-09-17
CN106658309A	2017-05-10
US20120321111A1	2012-12-20

SHENZHEN CIPRUN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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