ELECTRICAL CIRCUIT APPARATUS AND METHODS FOR ASSEMBLING SAME

Title:

ELECTRICAL CIRCUIT APPARATUS AND METHODS FOR ASSEMBLING SAME

Document Type and Number:

WIPO Patent Application WO2005038986

Kind Code:

A3

Abstract:

An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Inventors:

WALDVOGEL JOHN M (US)
BIELICK BRIAN R (US)
MILLER HERMAN J (US)
VAN CANNON BILLY J (US)

Application Number:

PCT/US2004/030740

Publication Date:

July 21, 2005

Filing Date:

September 17, 2004

Export Citation:

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Assignee:

MOTOROLA INC (US)
WALDVOGEL JOHN M (US)
BIELICK BRIAN R (US)
MILLER HERMAN J (US)
VAN CANNON BILLY J (US)

International Classes:

H01L23/367; H05K1/02; H05K3/00; H05K1/11; H05K3/34; H05K3/38; H05K3/44; (IPC1-7): H01L23/10; H01L23/12; H01L23/34; H01L23/48; H01L23/52; H01L21/44; H01L21/48; H01L21/50

Foreign References:

US6770967B2	2004-08-03
US5646444A	1997-07-08

Other References: