Title:
ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/195175
Kind Code:
A1
Abstract:
An electrical circuit formation method comprising: a fluid applying step for applying a conductive fluid to a position, on a metal wire formed on a resin layer, in which an electrode of an electronic component is to be mounted; a mounting step for mounting the electronic component so that the electrode contacts the conductive fluid; and a pressing step for pressing the electronic component onto the resin layer by means of a pressing member with a sheet sandwiched between the electronic component that has been mounted in the mounting step and the pressing member, the sheet having a surface with a friction coefficient lower than a friction coefficient of at least a part of a surface of the pressing member that faces the electronic component.
Inventors:
SAKAKIBARA RYO (JP)
Application Number:
PCT/JP2022/017408
Publication Date:
October 12, 2023
Filing Date:
April 08, 2022
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04; H05K3/12; H05K3/32
Domestic Patent References:
| WO2019054284A1 | 2019-03-21 |
Foreign References:
| JPH05102343A | 1993-04-23 | |||
| JPH0870200A | 1996-03-12 | |||
| JP2001024400A | 2001-01-26 | |||
| US20140153208A1 | 2014-06-05 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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