Title:
ELECTRICAL COMPONENT COOLING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/135278
Kind Code:
A1
Abstract:
Provided is an electrical component cooling structure that is useful for preventing condensation on electrical component cooling pipes constituting a portion of refrigerant piping. This electrical component cooling structure includes a heat exchanging body in contact with an electrical component and an electrical component cooling pipe embedded in the heat exchanging body. The electrical component cooling pipe is a jacket comprising an outer pipe (CP1) and an inner pipe (CP2). One end of the outer pipe (CP1) is a sealed end and the other end is a refrigerant outlet end, and one end of the inner pipe (CP2) is a refrigerant inlet end and the other end opens into the inside the outer pipe (CP1) on the sealed end side.
Inventors:
SUN YINGJUN
ZHANG LINGBO
OKAMOTO ATSUSHI
ZHANG LINGBO
OKAMOTO ATSUSHI
Application Number:
PCT/JP2017/047001
Publication Date:
July 26, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
F25B49/02; F28D15/02
Domestic Patent References:
| WO2016031195A1 | 2016-03-03 | |||
| WO2012059975A1 | 2012-05-10 | |||
| WO2011083756A1 | 2011-07-14 |
Foreign References:
| JP2001255027A | 2001-09-21 | |||
| JP2013055355A | 2013-03-21 | |||
| JP2016053469A | 2016-04-14 | |||
| JP3125120U | 2006-09-07 | |||
| US20100126209A1 | 2010-05-27 |
Attorney, Agent or Firm:
SHINJYU GLOBAL IP (JP)
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