Title:
ELECTRICAL CONNECTOR FOR SEMICONDUCTOR DEVICE TEST FIXTURE AND TEST ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2005089421
Kind Code:
A3
Abstract:
An interconnect assembly is for use in connection a semiconductor device under test (DUT) having a plurality of leads to electronic test equipment. The interconnect assembly includes a cable including a plurality of wires with at lest one wire for sensing a signal from a DUT, at least one wire for a forcing signal to the DUT, and at least one wire for a guarding signal driven by the same electrical potential as the forcing signal. A male connector includes the plurality of wires, an outer metal coating surrounding the plurality of wires, and an insulating coating around the outer metal coating. A receptacle connector is for receiving the male connector and plurality of wires with corresponding contacts.
Inventors:
CUEVAS PETER P (US)
Application Number:
PCT/US2005/008892
Publication Date:
May 04, 2006
Filing Date:
March 16, 2005
Export Citation:
Assignee:
QUALITAU INC (US)
CUEVAS PETER P (US)
CUEVAS PETER P (US)
International Classes:
H01R13/658; (IPC1-7): H01R13/648
Foreign References:
| US5417593A | 1995-05-23 | |||
| US6373255B2 | 2002-04-16 | |||
| US5647765A | 1997-07-15 | |||
| US4671593A | 1987-06-09 | |||
| US4917613A | 1990-04-17 |
Other References:
See also references of EP 1751828A4
Download PDF:
Previous Patent: EXPANSION OF NEURAL STEM CELLS WITH LIF
Next Patent: METHODS FOR PURIFYING CARBON MATERIALS
Next Patent: METHODS FOR PURIFYING CARBON MATERIALS