Title:
ELECTRICAL CONTACTS IN MICROELECTROMECHANICAL DEVICES WITH MULTIPLE SUBSTRATES
Document Type and Number:
WIPO Patent Application WO2006001921
Kind Code:
A3
Abstract:
Disclosed herein a microelectromechanical device having first and second substrates (120 and 122) that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent (136) that comprises an electrically conductive adhesive material.
Inventors:
PATEL SATYADEV (US)
RICHARDS PETER (US)
DOAN JONATHAN (US)
TARN TERRY (US)
RICHARDS PETER (US)
DOAN JONATHAN (US)
TARN TERRY (US)
Application Number:
PCT/US2005/016732
Publication Date:
May 11, 2006
Filing Date:
May 12, 2005
Export Citation:
Assignee:
REFLECTIVITY INC (US)
PATEL SATYADEV (US)
RICHARDS PETER (US)
DOAN JONATHAN (US)
TARN TERRY (US)
PATEL SATYADEV (US)
RICHARDS PETER (US)
DOAN JONATHAN (US)
TARN TERRY (US)
International Classes:
(IPC1-7): G02B26/00
Foreign References:
| US5999306A | 1999-12-07 | |||
| US20040145089A1 | 2004-07-29 | |||
| US4935086A | 1990-06-19 | |||
| US20050231792A1 | 2005-10-20 | |||
| US6731420B2 | 2004-05-04 |
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