Field of the Invention

A thermoelectric converter for new approach to Cooler (Air Conditioner), AC / DC, DC to

DC electrical converter.

Prior Art

This section describe background information related to present disclosure which is not prior art. Thermoelectric elements work according to principle of Peltier Effect and Seeback Effect. The Peltier effect is an effect in which a heat flux is created between the junctions of two different types of materials when an electrical current passed through thermocouple. The Seeback Effect is reverse of the Peltier Effect.

A thermoelectric element can convert either heat energy into electric power or electric power into heat. A thermoelectric conversion material made of a thermoelectric material that exhibits Seeback effect can obtain thermal energy from a heat source at a relatively low temperature and can convert the thermal energy into electric power. A thermoelectric conversion element made of thermoelectric material will be hereinafter called as“Thermoelectric Generator”. A thermoelectric generator consists of two thermoelectric semiconductors (n-type and p-type) subjected to a temperature difference, Thot - T _¥id , and electrically connected in series through conducting plates on the top and bottom. In the n-type semiconductor, most charge carriers are negatively charged electrons, whereas in the other one most of the carriers are positively charged holes. In a temperature gradient, electrons and holes tend to accumulate on the cold side. An electric field E develops between the cold side and the hot side of each material, which gives a voltage when integrated over the length of each. The voltages of the n-type and p-type semiconductors add up and drive an electrical current through an electrical load.

This application defines an electric to thermal to electric converter which is related to various improvements for many industrial fields such as chargers, electrical converters, cooling systems (like air conditioner, refrigerator, etc.), electrical isolators, power supply systems, voltage regulators. AC-DC converters are electrical circuits that transform alternating current (AC) input into direct current (DC) output. A traditional AC to DC converter is basically consist of an AC line filter, step down transformer, bridge rectifier and capacitors. They are used in power electronic applications where the power input a 50 Hz or 60 Hz sine- wave AC voltage that requires power conversion for a DC output. AC to DC converters use rectifiers to turn AC input into DC output, regulators to adjust the voltage level, and reservoir capacitors to smooth the pulsating DC.

However, disclosed invention only require cascade connected thermoelectric generators in order to generate DC voltage which has no ripples, no harmonics, no complex design compared to traditional converters. Any a ir condition ing or refrigerati n g un it must have fou r core components in order to work wh ich are compressor, conden ser, expansion valve and evaporator’while the invention related to cooler part consists of ju st thermoelectric generators connected to each other with various geometrical designs.

Various application of electrical converters, chargers, coolers (air conditioner) can be found in the prior art, as well as such patents. Included among these are:

V US 9,842,979 B2 Date of Dec.12, 2017

V US 9,837,593 B2 Date of Dec.5, 2017

V US 9,831,411 B2 Date of Nov.28, 2017

V US 9,829,221 B2 Date of Nov.28, 2017

V US 9,859,485 B1 Date of Jan.2, 2018

V US 8,779,275 B2 Date of Jul.15, 2014

V US 9,857,108 B2 Date of Jan 2, 2018

V US 9,861,006 B2 Date of Jan 2, 2018

V US 9,671,142 B2 Date of Jan 6, 2017

V RU 2,542,608 Date of Jan, 2006

None of these prior art examples provide for an air conditioner, AC/DC to DC converter, or charger using cascade connected thermoelectric generators.

SUMMARY OF THE INVENTION AND ADVANTAGES

The subject invention not limited to but comprises methods and apparatuses for electrical converters, electrical heater and cooler systems with thermoelectric system. The other aim of the system is to improve efficiency of thermoelectric systems. System is named as ETEC, Electric to Thermal To Electric Converter, since electric energy is converted to thermal energy difference, and this thermal energy difference is again converted to electric energy. This system can be used for various systems, not limited but such as electrical converters, cooling systems (refrigerating systems, air-conditioners, etc.), improving efficiency of thermoelectric systems, electric isolation systems.

ETEC may have various geometries and technics, some of them are mentioned in this invention. Classic ETEC system consists of three main parts.

First part, Power Source (PS), is controlled and because of the electric energy temperature difference is produced. This thermal energy can be created via thermoelectric modules as well as classic electrical heater and cooler systems or combination of those.

After generating the temperature difference between the junctions, one of the most critical issue is losing this thermal energy due to internal heat build-up. Dissipation of thermal energy to the atmosphere can be limited by thermal insulations and keeping close the thermal energy producing part with electric re-producing part. The other problem is that thermal main parameter of built up is the K factor, thermal conductivity. For high efficiency of the thermoelectric systems, K factor must be as low as possible. Therefore, transferring heat difference energy to another place decreases heat built-up of the system and also increases the duration of heat built-up.

Electric reproducing part is the third part of the ETEC. Electrical energy is reproduced from generated temperature difference via Thermoelectric Generators (TEG).

This ETEC system can be achieved at various methods and geometries. For example, with cascade connected thermoelectric modules sequenced as thermoelectric generations’ parts and electric reproducing parts inline. Temperature difference producing from electricity can be supported with methods other than thermoelectric devices where heat difference production also can be done only with than methods than thermoelectric devices.

ETEC geometries can be set up or arranged as cooling parts are outside of the geometry while heat is kept inside. Also, the opposite or hybrid arrangements can be achieved. This arrangements can be changed with changing polarity of the power supply only.

Instead of physically different modules, temperature difference production and electrical energy reproducing can be combined in same enclosure. The combination in same enclosure, ETECs is called mETEC (module ETEC) from now on. So, thermal transfer can be done with lower losses.

The sequence of cold parts and hot parts can be arranged in six different ways mainly. Some of the sequences can be changed with changing polarity of source. Some of the sequences can be changed with changing power source and load switching.

mETECs can also be sequenced in different topologies. For example, only cooling parts can be opened to outside in some arrangements.

Not limited but ETEC systems can be designed for purposes other than electrical converter like a cooler system. , for improving the efficiency, output power may also supply input power for electric cogeneration. At this technology level even, total efficiency of thermoelectric materials efficiency is not much.

As mentioned in summary of the invention, there are studies which the efficiency of the thermoelectric systems are more higher where the p and n junctions are physically very thin. On the other hand, making to much thin p and n junctions are not easy and these thin junctions are not mechanically stable as thick ones.

At p-n junction mETEC embodiment; easy manufacturing method with mechanically stronger thin junctions.

At mETEC, p junctions achieve temperature difference producing junctions and electric reproducing parts are achieved by n junctions. These p and n junctions are sequenced as one another. When p junctions are powered, the pn junctions function shall be as reversed biased diode. There is an electrically insulated gap while thermally high conductivity. Same can be applied as n junctions are temperature difference producing parts as well as n junctions are electric reproducing parts. With this method, multilayer pn junctions can be formed in one mETEC.

Not limited but it has a big advantage as: even if electric reproducing part is not connected or used as electric cogeneration, high efficiency thermoelectric module can be manufactured with better mechanical stability.

Not limited but some of the advantages of an ETEC system is that ETEC system produces DC power without ripple, with little harmonics, inherently electrically isolated power source and load at steady state

A cooling system can be made do with ETEC systems without using compressor or without an outdoor unit as in traditional air-conditioners. ABBREVIATIONS

TEG : Thermoelectric Generator

TED : Thermoelectric Device

PS : Power supply which can be AC, Rectified AC or DC

ETEC : Electrical to Thermal to Electrical Converter

mETEC: Meshed ETEC topology

oCETEC : Outside Cooling, Inside Heating Enclosed ETEC

oCmETEC: Outside Cooling, Inside Heating meshed ETEC

iCETEC : Outside Heating, Inside Cooling Enclosed ETEC

lCmETEC: Outside Heating, Inside Cooling meshed ETEC

AT: Generated temperature difference between hot side and cold side of a thermoelectric device or cooler when electric power is applied

K: Thermal Conductivity

H: Heated Side of TEG

C: Cooled Side of TEG

H’: Heating Side TED

C’: Cooling Side of TED

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 Basic schematically representation of the Embodiment,“Electric to Thermal to

Electric Converter” (ETEC).

Fig. 2 Prior art of a classic AC -DC Converter’s schematically AC to DC

Charger/Converter systems block diagram.

Fig. 3 Prior art: A classic thermoelectric device.

Fig. 4-A Prior art: A thermoelectric generator and its schematic representation.

Fig. 4-B Prior art: A thermoelectric cooler and its schematic representation. Fig. 5 Electrical cooling and heating are done other than Thermoelectric devices, DC is generated by TEGs.

Fig. 6 Thermoelectric Devices (TED) do Electrical cooling and heating, DC is generated by TEG.

Fig. 7 Schematically shows an Electric to Thermal to Electric Converter (ETEC) which is done wit Cascade connected thermoelectric devices.

Fig. 8 Schematically shows an Electric to Thermal to Electric Converter (ETEC) with combination of Cascade connected thermoelectric devices and other type electrical heaters/coolers.

Fig. 9 Schematically shows one exemplary 3 dimensional ETEC. Geometries aim is for optimization and keeping heat inside and saving the edge thermal energy.

Fig. 10 Schematically shows another exemplary 2 dimensional geometry where heat is kept inside.

Fig. 11 Schematically shows exemplary 2 dimensional geometry where heat is kept inside and where heating and cooling are supported with electrical heaters and coolers. Fig. 12 Schematically shows a Combined ETEC module. Thermoelectric modules for creating heat difference and thermoelectric modules for creating electricity from heat difference is combined as one module.

Fig. 13 Schematically shows all possible internal permutations of Combined ETEC

Modules which one is shown at Fig. 12.

Fig. 14-A Schematically shows an ETEC with 2 Combined ETEC modules for better heat keeping inside of the system.

Fig. 14-B Schematically shows Fig. 14-A is additionally supported with conventional electrical coolers.

Fig. 15-A Schematically shows exemplary 3-D dimensional layout for ETEC with combined

ETEC modules.

Fig. 15-B Schematically shows A-B cross-section of Fig. 15-A.

Fig. 16-A oCETEC- Outside Cooling, Inside Heating Enclosed ETEC with Electrical

Cogeneration.

Fig. 16-B iCETEC- Outside Heating, Inside Cooling Enclosed ETEC with Electrical

Cogeneration.

Fig. 16-C iCETEC- Outside Heating, Inside Cooling Enclosed ETEC with Electrical

Cogeneration. Fig. 17-A An example of a back to back ETEC module part of electrically insulator but good thermal conductive junction.

Fig. 17-B A schematic example of back to back ETEC module part.

Fig. 17-C Another schematic example of back to back ETEC module part.

LIST OF REFERENCE NUMERALS

100: ETEC; Electric to Thermal to Electric Converter; Basic schematic drawing of the invention

101 : PS; Electrical Power Supply, which can be AC, rectified AC or DC

102: OPCU; Output Control Unit; Electrical control unit which handles electrical output.

103: Electrical power, which is used at some cases, which it is not there in some other cases

104: Medium where thermal energy is transferred from temperature difference generation part to electric generation part

110: Part where thermal energy (temperature difference) is generated by using electrical energy where Electrical‘Heating and/or cooling’ with Thermoelectric Devices (TEDs) and/or other electrical devices

120: Electrical Energy Generation part with Thermoelectric (or Thermoionic) devices.

300: A typical Thermoelectric device/module (TED)

301 : “p” junctions of TED

302: “n” junctions of TED

303 : Upper side Electrodes

304: Bottom side Electrodes

305: Substrates

410: Thermoelectric Generator

411 : H ; Heated Side of TEG or Side where Heat is applied

412: C ; Cooled Side of TEG or Side where Cold Applied

420: Thermoelectric Device heating and cooling when power applied

421 : H’ ; Hot Side of Thermoelectric device/module

422: C’ ; Cold Side of Thermoelectric device/module

501 : Conventional Electrical heater other than thermoelectric device 502: Conventional Electrical cooler other than thermoelectric device

700: Typical cascade connected multilayer ETEC

710: Typical cascade connected, with combined electrical heater and coolers, multilayer ETEC

(ComETEC)

800: CC’H’H type ETEC Module. mETEC. Thermal energy production parts and electricity reproduction parts are meshed.

801 : H ; Heated Side of meshed ETEC (mETEC) module or Side where Heat is applied

802: C ; Cooled Side of meshed ETEC (mETEC) module or Side where Cold Applied

803: H’ ; Hot Side of meshed ETEC (mETEC) module, heat emission side

804: C’ ; Cold Side of meshed ETEC (mETEC) module, heat absorbed side

805: Insulation, both dielectric and heat insulated coating

806: Dielectric and heat insulation filling

807: Dielectric but good thermally conductive filling

810: Simple representation of 800, CC’H’H mETEC

850: A cylindrical mETEC example.

851 : Outer part of the cylindrical mETEC. 1st layer from outside to inside.

852: 2nd layer from outside to inside of cylindrical mETEC.

853: 3rd layer from outside to inside of cylindrical mETEC

854: 4th layer from outside to inside of cylindrical mETEC

855: core part of the cylindrical mETEC

856: Input power controlling unit of ETEC

857: Output power controlling unit of ETEC

1000: A part of the mETEC: Side to side merged part of semiconductor parts of thermal energy production parts and electricity reproduction parts.

1010: pn junction insulator or heat permeable but dielectric junction, Anode part

1011 : A part of the semiconductor of thermal energy producing part of the mETEC

1012: A part of the semiconductor of electricity reproducing part of the mETEC

1100: A part of the exemplary mETEC and it internal connection and layout

1200: Another example of mETEC with different internal connections of 1100 DETAILED DESCRIPTION OF THE PREFERED EMBODIMENT

The subject invention comprises techniques and methods of electric to thermal to electric conversions using thermoelectric devices and improving thermoelectric devices features. Since these techniques are new approach, they can be applied to much type of applications. While the techniques are described, some applications of these techniques will be mentioned herein. In addition, some improvements on techniques and thermoelectric devices are mentioned like electrical converter, enhancing efficiency of thermoelectric devices, coolers and heaters, isolators, etc.

FIG. 1 is basic representation of Electric to Thermal to electric converter (ETEC). ETEC has five main parts which are a) power source 101, where input power is utilized or directly applied, b) part 110 is electrical equipment and/or thermoelectric devices where thermal energy is generated, c) 104 where thermal energy is transferred, d) 120 where electrical equipment and/or thermoelectric devices which electrical energy is reproduced, e) 102 where output power utilization and/or power feedback is formed.

The power Source (PS) 101, is either AC, rectified AC or pure DC. Inlet power can be also utilized before applying to ETEC.

Electrical energy is converted to thermal energy as temperature difference at 110. This can be done via conventional electrical heating/cooling methods or via thermoelectric devices. Hybrid system which is combined by conventional methods and thermoelectric devices can be used also. 104, is the middle, where thermal energy is transferred from temperature difference generation part to electric generation part.

At 120, heat energy is converted to electrical energy via thermoelectric devices. 102 is output power control unit where output power is utilized according to needs. Electrical power feedback also can be adapted according to application like improving electrical efficiency of a refrigeration or cooling system done with ETEC.

One application of ETEC is AC/DC to DC converter. At FIG.2 a classic AC -DC converter block diagram is shown. Traditional AC/DC converters require transformers, rectifying circuits, etc. and they have high THD (Total harmonic distortion) and ripple unless filter is used.

Comparing with classic AC -DC converters ETEC has significant advantages like simply circuit design, no ripples, low harmonics, inherit electric isolation. In addition, additional advantages can be utilized with developed ETEC geometries and technics like cooling instead of heating.

ETEC has advantages like simply circuit design because it does not require rectifying circuits, extra components to rectify sinusoidal waves, and electrical filters. ETEC does not have ripple since output is pure DC at constant temperature difference. It has no harmonics since there is no harmonic producer’s circuits. It has got inherit electric isolation since there is a thermal layer between power source and output.

At FIG. 3 it is shown a representation of a classic thermoelectric device to define its basic components for better explanation of details.

At FIG. 4-A, it is shown a representation of a basic Thermoelectric generator. When heat applied to site 411 and heat absorbed from site 412 an electric power is produced at Thermoelectric generator 410. At right hand site of the FIG 4-A, thermoelectric generator’s simple outline is shown with heated and cooled sides.

At FIG. 4-B, it is shown a representation of a basic Thermoelectric cooler. When electricity is applied, there will be temperature difference between 420 which is cold side and 420 which is hot side.. At right hand site of the FIG 4, thermoelectric cooler’s simple outline is shown with heat emission and cooler sides.

As seen at FIG. 5; temperature difference can be produced with some other methods rather than thermoelectric devices. At this figure, FIG. 5, one side of a thermoelectric generator is heated with an electrical heater while the other side is cooled with an electrical cooler. This representation is one of the simplest way of ETEC (Electric to Thermal to Electric Converter).

FIG. 6, shows an ETEC where temperature difference is generated via Thermoelectric devices. Additional electrical heaters and electrical coolers can be inserted between 420 and 410.

ETEC device shown in FIG. 7 is consist of cascade connected Thermoelectric devices where TEGs are thermoelectric generators are placed between TEDs (devices where heat difference is generated). At this FIG. 7, electrical power source is powering 420 (TEDs), where 410 (TEGs) are placed between these 420s. The upmost 420’s heating side (H’) is heating the upmost 410’s H (heated side) while the 410’s cooled side is cooled by another 420’s cooling side. With this kind of cascade connection, every 410 is subject to temperature difference which is generated with 2 different 420s except there are ones at end sides like the TEG at the bottom in

FIG. 7. Normally in a thermoelectric cooler, there is a heat buildup. After a TED or TEC is powered at the initial state, the cool side is cooler than ambient temperature. Then heat side is hotter than cool side where AT is constant. After a while, hot side and cold side together becomes hotter while temperature difference (AT) stays stable. In some applications, like Thermoelectric cooling hot side is cooled via various methods so cold side is also cooler as AT than hot side. This heat buildup occurs in Thermoelectric Devices or Thermoelectric Coolers since thermal conductivity (k) is not zero. In TEGs, thermal conductivity occurs since all these temperature difference is not converted to electric energy because thermal conductivity (k) is not zero.

At a cascade connected ETEC system as an example FIG. 7; heat buildup on one of the Thermoelectric devices in ETEC is less than normal heat buildup of that TED as standalone. At cascade connections, heat buildup is lower since thermal propagation is also to the heaters and electrical coolers.

It may be simple but straight cascade connections like FIG. 7 is not only type of cascade connections. At FIG. 7 cascade connection end points are open (open-end). On the other hand, it is possible to settle this open-end problem with different type of cascade connection. One of this kind of connection type is shown in FIG. 9 where every TEDs or TEGs contacting with another TEDs or TEGs where the thermoelectric equipment are settled as a cylindrical geometry.

Another cascade connected ETEC example is shown at FIG. 10, where heat is kept inside geometry while outside is kept cool. At this geometry, heating sides of TEDs are all at the middle while cooling parts of TEDs are outside. TEGs arrangements are similar as heated sides are placed to middle while cooled sides are at the outside. Spherical or cylindrical 3D cascade connections of these examples can also be done.

At FIG. 11, electrical heater and electrical cooler supports are added to kind of FIG. 10. If TEGs (410s) are removed as well as OPCU while cooling 502 is placed, it is similar one of the prior art patent as described in US patent 5,228,923 cylindrical thermoelectric cells.

At Figures 5, 6, 7, 8, 9, 10 and 11 ETEC system’s temperature difference creating parts (TEDs and other type of devices) and electricity producing parts (TEGs) can be consist of separated parts and equipment where combined to construct ETEC.

On the other hand, it has advantages to combine TED and TEG as one module. These advantages are not limited with like decreasing thermal energy loses, increasing efficiency of the system and constructing specific systems with ability to do different type of geometries for application specific.

FIG. 12 schematically shows meshed or combined ETEC module. At embodiments discussed earlier are based on as separate different parts as heat difference creating part, heat difference transfer medium and electricity regenerating part. But here, the part are meshed. At FIG. 12, when power is applied heat difference is created inside of the mETEC module where 803 is heating part while 804 is cooling part. 807 is the filling medium where thermal conductivity is high but dielectric . Where 806 is the thermal conductivity is low and dielectric. When module is powered, 804 is cooling and 803 is heating. Where, electricity is reproduced via 801 and 802.

Brief representation of mETEC is shown at bottom of fig.12 (800).

Meshed ETEC (mETEC) is various combinations according to sequencing of C, C’, H and FF. These six combinations are shown in FIG.13.

These mETEC modules can be used in different arrangements and cascade connections for optimizing different kind of applications. FIG.14- A is an exemplary arrangement of mETEC where heat is kept inside if K factor is big enough. At FIG.14-B is similar to FIG.14- A additionally inside cooling is done.

820, which is shown in FIG.15. -A, is another cascade connected arrangement with multiple mETEC modules. FIG.15-B is cross section of 820.

820 is a cylindrical mETEC consists of multiple mETEC modules. On the other hand, to get advantages of this cylindrical ETEC system mETEC module can be manufactured as one cylindrical module as 850 in FIG.16- A. This cylindrical mETEC single module is cascaded (ordering) as CC’FFH where outside is cooler than inside. At the middle of 850, heating or cooling systems can be added. If ETEC system desired to be used different than electrical converter, not limited to but like high efficiency Thermoelectric Cooler. An electric cogeneration (857) can be added to system to improve total efficiency. 856 is input power control unit for regulating and controlling input power and electric cogeneration. With input power controlling 856 and 857 unit cascading (ordering) can be changed with electrical switching.

At FIG.16-B, 850’s cascading ordering is as HH’C’C, where outside is hotter than inside.

At FIG.16-C, 850’s cascading ordering is as C’CHH’, where heat is kept inside and outside is cooler. A Thermoelectric Modules efficiency highly depends on the K factor, thermal conductivity. When the K is desired to be low in TECs high K factor means high thermal build up and low efficiency. On the other hand, without changing the materials heat buildup over semiconductors can be decreased. One way is physically decreasing the thickness of semiconductors. The other way is that by making a physical contact of semiconductors (especially at the hot side) with other material, heat transfer occurs instead of heat build-up on semiconductor. These two improvements application can be achieved on mETEC module.

In FIG.17-A; 1000 is a part of the mETEC, side to side merged part of semiconductor parts of thermal energy production parts and electricity reproduction parts. 1011 is a part of semiconductor of 110, which is semiconductor part of temperature difference producing. 1012 is a part of semiconductor of 120, which is semiconductor part of electricity producing. When 1011 is powered, it has higher voltage than 1012. The aim of application is a depletion region (1010) with p-n junctions. At mETEC, there is an insulation with high thermal conductivity but dielectric. With the depletion of region (1010), a dielectric but highly thermal conductive area is obtained. Another advantage of this application, consecutive p and n semiconductors can be made very thin with more mechanical strength compared with similar standalone types for Thermoelectric devices.

At FIG.17-B, 1100 a type of mETEC whose semiconductor parts of the device are placed consecutively (back to back). 1011s are anode part of the system, 110, where temperature difference is created. 1012s are the cathode part of the system, where electricity is reproduced from temperature difference (120). 1010s are the depletion regions where it occurs with semiconductors are constructed with one after. 1011s are connected with each other and with power source (PS) via upper and bottom conductors, which also can be used to transfer heat and cold. 1012s are connected with wires 1013s. These electric connections may be done with different ways.

At FIG.17-C, another example of mETEC (110) where electrical connections for 1012s are different than the one at FIG.17-B.

For FIG.17-A, FIG.17-B and FIG.17-C; p and n type semiconductors arrangements are not limited with the types shown in the drawings, which can be done also using different ways.

An Electrical to thermal to electrical converter(ETEC) for generating electric energy by using thermal difference, characterized by comprising; • At least one Electrical Power Supply,

• An apparatus for providing temperature difference,

• Medium for transferring temperature to Thermoelectric Generator(TEG) by conservation of the temperature,

• At least one Thermoelectric Generator(TEG) for generating Electrical energy from a temperature difference.

A Meshed Electrical to thermal to electrical converter(ETEC) for generating electric energy by using thermal difference, characterized by comprising;

• At least one Electrical Power Supply,

• Side to side merged part of at least one semiconductor parts of at least one thermal energy production parts and at least one electricity reproduction parts,

• thermoelectric materials for providing temperature difference,

• At least one a depletion region (1010) for an insulation with high thermal conductivity but dielectric and the depletion regions where it occurs with semiconductors are constructed with one after.

An apparatus for providing temperature difference, Medium for transferring temperature and regenerating electric energy in ETEC that can made separately from each other. In mesh etec, thermoelectric materials for providing temperature difference and p-n junctions of thermoelectric materials which are regenerating electric energy that are meshed. Thermoelectric materials comprises p-n junctions.

Benefits of Mesh ETEC against normal ETEC;

• Less Heat Difference Transfer medium. Which increase total ETEC efficiency.

• Able to make Thinner p-n junction for thermoelectric devices. Which benefits increase of efficiency of Thermoelectric Devices.

• Smaller and modular ETEC constructions.

Apparatus are, not limited but as, AC/DC, DC/DC, electric converters. Apparatuses for providing temperature difference are: Thermoelectric devices which are producing heat difference with electric power or electric heaters and electric cooler or combinations of any kind of cooling and heating electrical devices.

Apparatus of medium that transferring temperature difference are: materials or coatings which are electrically insulator (dielectric) but has high temperature conductivity. (Like dielectric ceramics, thermoplastics, etc.)

Apparatus for regenerating electric energy is done with Thermoelectric Generator(s).

According to preferred embodiment of the invention, At least one semiconductor parts of the device are placed consecutively (back to back).

According to another preferred embodiment of the invention, at least one thermal energy production parts are at least one anode part where temperature difference is created.

According to another preferred embodiment of the invention, at least one electricity reproduction parts at least one cathode part of the where electricity is reproduced from temperature difference.

According to another preferred embodiment of the invention, Electrical Power Supply are AC, rectified AC or DC.

According to another preferred embodiment of the invention, A Meshed Electrical to thermal to electrical converter (ETEC) comprises an Output Control Unit.

According to another preferred embodiment of the invention, Electrical to thermal to electrical converter (ETEC) comprises an Output Control Unit.

According to another preferred embodiment of the invention, the Electrical to thermal to electrical converter (ETEC) geometry are 3 dimensional for optimization and keeping heat inside and saving the edge thermal energy or 2 dimensional geometry to keep the heat inside.

According to another preferred embodiment of the invention, An Electrical to thermal to electrical converter (ETEC) comprises Thermoelectric modules for creating heat difference and thermoelectric modules for creating electricity from heat difference is combined as one module.

According to another preferred embodiment of the invention, coatings are ceramics or thermoplastics.