FIELD OF THE INVENTION

[0001] The present invention relates to an electrical connector for glass applications especially relevant in electrical assemblies on the surface of glass. More specifically to an electrical connector used for carrying electrical current to a pane comprising an electrically conductive element like a metallic layer or wire. Electrical conductor and conductive layer are joined together by a solder paste or a conductive adhesive or a glue. Even more specifically to an electrical connector for a pane of a vehicle. Furthermore specifically, the subject-matter of the invention relates to an electrical connector that is useful to transfer electrical energy to an electrical device of a vehicle, such as but not limited to defogger, defroster, heating grid, antenna and etc. or a decorative glass panel or a window of a building.

BACKGROUND OF THE INVENTION

[0002] Electrical connectors are known in the art for use on glass surfaces, especially in vehicles. The connectors are assembled to and in electrical communication with an electrically conductive layer/wire provided on the glass surface for transferring electrical energy to the electrical device. More specifically, the conductive layers, which generally include silver, are screen printed or deposited on a substrate that is formed from glass, such as a backlite, sidelite, roof or windshield of a vehicle. The conductive layers typically extend horizontally across the window panes. The conductive layers can also form the electrical devices such as in general defoggers, defrosters, heating grids and antennas and etc.

[0003] The electrical assemblies in vehicles generally experiences harsh conditions on the road. Automotive electronics commonly exposed to rapid temperature changes as low as - 50 °C to as high as + 120 °C depending on the seasons or continents. The differences in coefficients of thermal expansion (CTE) between different components of the electrical assembly result in residual stresses built up during the temperature fluctuations. Such stresses cause cracking or other damage to the glass substrates or malfunctioning of the electrical devices such as defoggers, defrosters, and antennas. The residual stresses may also arise from other source such as fatigue or vibrational loads in the service of a vehicle. [0004] Traditionally, the connector are attached to the glass in design of electrical assemblies using a lead containing solder material. The joining material not only allow transfer of current from connector to conductive layer or wire but also maintains the electrical joint integrity during thermal fluctuations or mechanical loads or vibrational loads. The lead present in solder is a deformable metal, and it does not involve in any chemical reactions such as formation of intermetallics during the soldering process. Thus lead can flow freely in the joints, thereby it can compensate the CTE differences between the connector and the substrate resulting from temperature changes in the assembles, and thereby minimizes the mechanical failure of pane. Furthermore, the lead resists delamination from the conductive layers. However, it is known that lead is considered as an environmental contaminant and also use of lead is banned by regulations in many jurisdictions. As such, there is a motivation in many industries, including the automotive industry, to move away from all uses of lead in vehicles. The new regulation not only mandated to replace the lead in solders.

[0005] Various attempts to replace lead from conventional solders are still a major research focus. Parallel developments also in progress in to find alternative solutions such as solderless approaches. Despite all the attempts a perfect solution yet to be found to replace lead based joining materials completely in automotive electronics. So far, well-known lead-free solders are the materials containing tin, copper, silver, antimony etc are mechanically stiff. They exhibit good resistance against temperature fluctuations, but tend to delaminate easily or fail during vibrational or impact loads. Other classes of lead-free solders based on tin, bismuth, indium are low melting materials, perform better against fatigue loads, but softens at high temperatures of operation. On the other hand solderless solutions such as conductive glues are still immature to fulfill needs of automotive electronics.

[0006] Alternately connector materials used in the electrical assemblies can be changed to minimize thermal residual stresses. Conventional connector material such as copper exhibits superior electrical conductivity, thermal conductivity and low specific heat values, but possess high CTE (16.7 ppm/°C) compared to glass. The higher CTE differences between connector and substrate materials is not an ideal situation to use copper in lead-free electrical assemblies. Lead-free joining materials are generally less flexible compared lead based solders, which makes it difficult to find connector material ideally suitable for a specific glass substrate. There is a need to investigate a tailor-made connector material specific to the glass substrate depending on the use or application.

[0007] Although various materials proposed as connector replacement to copper for use in the window panes of vehicles, such developments have little applicability to electrical connector technology. For example, United States Patent No. 6,396,026 discloses a laminated pane for a vehicle including an electrical conductor disposed between two glass panes. The electrical conductor includes a layered structure that may include titanium to provide rigidity to the electrical conductor. The electrical conductor is positioned in an interlayer between the panes. In this position, the electrical conductor is spaced from the glass panes. The titanium-containing conductor in the '026 patent cannot effectively function as a connector that connects a power supply to a conductor that is operatively connected to one of the glass panes. More specifically, the titanium is disclosed as a core of the conductor, with an outer surface including a more conductive metal such as copper. The titanium core with the outer surface including copper is ineffective for use as an electrical connector due to the presence of the copper because the copper would delaminate from the conductor due to mechanical stress between the copper and the glass pane due to thermal expansion of the copper and the glass pane resulting from changes in temperature.

[0008] For example, European Patent No. EP1657964 and EP1942703 also disclose a laminated pane for a vehicle including an electrical connector provided on the glass panes. The electrical connector includes a layered structure that may include titanium to provide rigidity to the electrical connector.

[0009] For example, European Patent No. EP2708091 also discloses a laminated pane for a vehicle including an electrical connection element provided on the glass panes by soldering through a conductive layer. The electrical connection element includes a layered structure that may include chromium-containing steel.

[0010] Although the problem of difference between coefficients of thermal expansion of the substrate and the connector partially solved in cited prior art, there is still a need for coating on the connector itself for a better electrical conductivity of which persists the delamination problem and also the need for cooling the substrate in manufacturing or soldering step to avoid any thermal and mechanical stress build up on the substrate.

[0011] Thus, there remains a clear need of finding an appropriate replacement to conventional copper connectors alongside of lead-free solder for a more environmental friendly alternative. Underlying motivation is reducing the mechanical stress between the connector and the substrate due to thermal expansion of the connector and the substrate resulting from changes in temperature, resist delamination from the conductive layer or the connector itself, and further operate without degradation for a long lasting operation, and further conduct electricity without a conductive coating, and further transfer heat outwardly by not building too much thermal stress on the substrate.

SUMMARY OF THE INVENTION

[0012] The connector of the present invention is suitable for a pane comprising a substrate formed from glass and an electrically conductive element provided on at least a portion of the substrate and the connector is to be attached or connected to the conductive element to be in electrical communication, and the connector is made of A and B, wherein A is copper and B is one of the five refractory metals which are molybdenum, niobium, rhenium, tantalum and tungsten or combinations thereof. Both A and B metals are having impurities at commercially available limits.

[0013] The substrate has a first coefficient of thermal expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 6 x 10-6 I °C for minimizing the mechanical stress between the connector and the substrate due to thermal expansion of the connector and the substrate resulting from changes in temperature. As a result, the connector resists delamination from the substrate and the electrically conductive element.

[0014] The connector of the present invention has a low specific heat capacity which is lower than 0.3 J/gK, especially in the proximity of 0.2 J/gK. As such, the connector will heat and cool quickly enough that eliminates thermal energy to build up on the substrate. Furthermore, the connector of the present invention has a good electrical conductivity and low electrical resistance that the connector can be used as itself on the substrate without a need for electrically conductive coating.

[0015] The present invention provides an electrical connector for a pane. The pane includes a substrate formed from glass. The present invention also provides the pane including the electrical connector and a vehicle including the pane. The present invention relates, in another aspect, to usage of a such connector in glass applications. The present invention also relates, in another aspect, to utilization of a such pane in automotive or architecture or telecommunication industry. An electrical connector and an electrically conductive element such as a layer or a wire provided on the substrate may form an electrical device or at least some part of the electrical device. The connector is operatively connected to and in electrical communication with the conductive element for transferring electrical energy to the electrical device.

[0016] The present invention also relates the physical, electrical and thermal properties of a connector, more specifically of a connector material and even more specifically connectors utilized on glass surfaces. The present invention relates, in another aspect, to usage of such material in electrical connectors on glass panes. The present invention provides a connector which can withstand to large thermal fluctuations and mechanical stress. The proposed connectors are superior in material properties such as low heat capacity, high electrical and thermal conductivity requirements. As a result of low specific heat and high thermal conductivity values, a considerable reduction of the overall thermal burden on the substrate during the attachment process and also reduction of the overall mechanical stress on the substrate in operation due to environmental effects. Furthermore, the present invention provides a connector more stable in wide range of temperatures and also at high working temperatures, more rigidity and more flexural strength to the joint assembly of the substrate with electrically conductive element and the connector. In addition to all above, the present invention provides a connector with said properties is robust and energetically efficient.

[0017] The present invention further concerns providing a unique (tailor-made) solution for glass substrates in automotive industry and decorative glasses in building constructions such as vehicle comprising such an assembly comprising the pane, electrical device and the connector not to mechanically fail abruptly.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The invention will now be described further, byway of examples, with reference to the accompanying drawings, wherein like reference numerals refer to like elements in the various figures. These examples are provided by way of illustration and not of limitation. The drawings are a schematic representation and not true to scale. The drawings do not restrict the invention in any way. More advantages will be explained with examples.

[0019] Fig.1 illustrates the connector being a disk-shaped, while Fig.2 illustrates connector being a bridge-shaped connector.

Fig.3 and Fig.4 illustrates different embodiments for different electrical devices.

Fig.5 and Fig.6 illustrates a side-cut view of a pane and a connector.

[0020] The elements illustrated in the figures are numbered as follows:

1 . Connector

2. Pane

3. Substrate

4. Conductive element

5. Solder

6. Adhesive/glue

7. Electrical device

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0021] The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims.

[0022] While some embodiments described herein include some but not other features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention, and form different embodiments, as would be understood by those in the art. For example, in the following claims, any of the claimed embodiments can be used in any combination.

[0023] “connector” and “electrical connector” and “electrically conductive connector” are used interchangeably throughout the text, “pane” and “window pane” and “glass pane” and “glazing” and “laminated glazing” are used interchangeably throughout the text, “in electrical communication” or “in an electrically communicated manner” throughout the text is to be understood as electrical current can flow between the mentioned two elements regardless of having an actual physical contact.

[0024] Referring the figures, wherein like numerals indicate like or corresponding parts throughout the several views, a pane (2) is generally shown per se and it can be utilized on a vehicle or alike. The pane (2) comprises a substrate (3) that has a first coefficient of thermal expansion. According to the present invention, the substate is a glass substrate. The glass is further defined as an automotive glass but not limited to. In a preferred embodiment, the automotive glass is further defined as soda lime silica glass, which is well known for use in window panes (2) of vehicles. However, it is to be appreciated that the glass may be any type of glass composition that is known in the art like the borosilicate, quartz, flat or curved or float or etc.

[0025] The present invention proposes a wired connection to a pane (2) formed from glass to be utilized in a vehicle and more preferably on a laminated glazing but not limited to. A vehicle should be understood as any conveyor that transfers anything from point a to point b which includes any land, air or sea vehicles like car, van, lorry, motorbike, bus, tram, train, drone, airplane, helicopter and the like.

[0026] A laminated glazing refers to at least two sheets of glass being laminated with an interlayer. The sheets of glass can be made of (mineral) glass, more specifically a silica-based glass, such as soda-lime-silica, alumino-silicate or boro-silicate type glass. The interlayer is usually made of polyvinyl butyral (PVB) or ethylene-vinyl acetate (EVA).

[0027] An electrically conductive element (4) is applied across a region of the substrate (3) such that the conductive element (4) is on at least a portion of the substrate (3). Preferably, the conductive element (4) includes silver, however, it is to be appreciated that other conductive metals may also be suitable for the conductive element (4). Generally the conductive element (4) is formed on a surface of the glass sheet by sintering a silver paste containing a silver powder and a glass frit and which can also be deposited or painted or printed on the pane (2) surface or by any method as long as providing an electrically conductive element (4) on the surface of the substrate (3). The electrically conductive element (4) may be visible on the window pane (2) and typically comprises lines that extend horizontally across the window pane (2) but also it can be transparent electrically conductive element (4). The conductive element (4) is preferably part of an electrical device (7) like a defogger, defroster, antenna, or combination thereof. However, the conductive element (4) may serve any function known in the art for such conductive elements (4).

[0028] In another embodiment of the present invention, the substrate (3) material is an amorphous substance in the form of flat long plate or curved glass sheet or glass sheet coated with electrically conductive element (4) as on one or two of its surfaces to facilitate an electrical joint and an electrical device (7).

[0029] In other embodiments the conductive element (4) in the present invention may be screen printed or deposited by physical or chemical vapor deposition techniques or simply painted on the surface(s) of the substrate (3). In some other embodiments, the conductive element (4) may comprise one or more of the following materials such as but not limited to C, Graphene, Ag, Au, Cu, Ni, Al, Ti, Or, Fe, V or W.

[0030] Referring to figures 1 to 4, an electrical connector (1 ) is operatively connected to and in electrical communication with the conductive element (4). The pane (2) comprises a substrate (3) that has a first coefficient of thermal expansion and the electrical connector (1 ) has a second coefficient of thermal expansion. Together, the conductive element (4) and the connector (1 ) may form an electrical device (7) or some part of it. The connector (1 ) is aimed to transfer electric current or a signal to the electrical device (7) via the conductive element (4) provided on the substrate (3). The current or signal is carried over electrically conductive cables (not shown) which are in electrical communication with the connector (1 ) of the present invention.

[0031] In one embodiment of the present invention, a layer of solderable material is bonded to the electrical connector (1 ). A layer of solder (5) preferably lead-free is bonded to the layer of solderable metal and the conductive element (4), with the connector (1 ) and the conductive element (4) in electrical communication through the layer of solderable metal and the layer of solder (5). The soldering material solders the electrically connector (1 ) to the electrically conductive element (4). The soldering material can be made of lead alloys or lead-free alloys depending of the legislation and/or the thermal expansion needed between the substrate element and the electrically conductive structure.

[0032] In different embodiments of the present invention, the soldering material could be replaced by a conductive adhesive or glue (6) that the connector (1 ) is attached to the conductive element (4) by a conductive glue or adhesive (6) such that the connector (1 ) is fixed to the conductive element (4) in an electrically communicated manner.

[0033] The connector (1 ) of the present invention is for a pane (2) comprising a substrate (3) formed from glass and a conductive element (4) provided on at least a portion of the substrate (3) and the connector (1 ) is to be connected to the conductive element (4) in electrical communication and wherein the connector (1 ) is made of from A and B, where A is copper and B is one of the five refractory metals or combinations thereof, i.e., B is selected from the list of molybdenum, niobium, rhenium, tantalum and tungsten or combinations thereof. It is to be understood that these materials are available as in the commercial purity range that the connector (1 ) is made of what is commercially available, therefore “made of’ should be understood as in the context of commercial purity range, such as 90% to 99.99%. Refractory metals as molybdenum, niobium, rhenium, tantalum and tungsten are known for their very high melting temperatures, they also have relatively low thermal expansion coefficient comparing to copper. Depending on the type of the glass utilized as substrate (3) for the pane (2), the coefficient of thermal expansion of the substrate (3) is generally in the range 3 x 10’ ⁶ / °C to 15 x 10’ ⁶ 1 °C. Copper and one of the refractory metals or their combination thereof is mixed to have such a material of which the connector (1 ) is made of that the difference of the coefficient of thermal expansion between the connector (1 ) and the substrate (3) is less than or equal to 6 x 10’ ⁶ / °C.

[0034] Refractory metals as a class of materials are understood to share the common properties of very high melting temperature and mechanical properties and wear resistance. A narrowly defined class of refractory metals would include metals with melting points higher than 2000°C: niobium, molybdenum, tantalum, tungsten, and rhenium. According to the most common definition, refractory metals comprise elements of the Group VB and VIB with a melting point higher than 2000°C; these are niobium, tantalum, molybdenum, and tungsten. In some publications the VIIB metal rhenium is also included, as it does not fit in any other classification. Refractory metals are a broad category of metallic materials that display excellent durability to thermal and mechanical stress.

[0035] Preferably, the specific heat capacity of the connector (1 ) of the present invention is lower than 0.3 J/gK, more specifically lower than 0.25 J/gK and more preferably around/close to 0.2 J/gK, the wording “around” or “proximity” or “close to” in this context should be understood as in the range of ± 0.05 J/gK. Having such a low heat capacity for the connector (1 ) itself facilitates quick and even heat distribution in manufacturing step like soldering and also in operation when temperature changing drastically providing a reduction on the thermal stress over the substrate (3) for longterm operation.

[0036] Preferably, the connector (1 ) made of A and B (of commercial purity) is in the form of an alloy, or composite or a cladded sheet. The selection may base on the physical properties of the material such as thermal expansion coefficient and/or specific heat capacity. The thermal expansion coefficient is selected based on the difference of thermal expansion coefficients being less than or equal to 6 x 10’ ⁶ / °C between the connector (1 ) and the substrate (3). The specific heat capacity of the connector (1 ) is preferably in the proximity of 0.2 J/gK. The electrical and thermal conductivities of the connector (1 ) are selected preferably on the higher side of the selected compositions.

[0037] Preferably, the B ratio in the material composition of connector (1 ) made of A and B is in the range of 30% to 90% by weight based on the total weight of the connector (1 ), more preferably in the range of 50% to 90% by weight based on the total weight of the connector (1 ). The material composition of the connector (1 ) made of A and B material may be selected based on coefficient of thermal expansion being close to the substrate (3) material. More specifically, the difference of coefficients of thermal expansion between the connector (1 ) and substrate (3) materials within the range of 6 x 10’ ⁶ / °C. The connector (1 ) is mainly to serve as a current carrier, and also to support the mechanical assembly of the joints, i.e. , the connector (1 ) and the conductive element (4)preferably on the pane (2) in various automotive electronic designs. Furthermore in specifically, the refractory metal ratio in the connector (1 ) made of copper and refractory metals may be selected depending on the nature of the intended applications.

[0038] In another embodiment of the present invention, the connector (1 ) may further comprise a metal selected from the group of iron, aluminum, tin, cobalt, nickel, zirconium, vanadium, chromium, palladium, ruthenium, titanium, hafnium, indium, platinum and combinations thereof, of which may be suitable for adding in the mixture of copper and refractory metals for the connector (1 ) so long as a difference between the first coefficient of thermal expansion of the substrate (3) and the second coefficient of thermal expansion of the connector (1 ) is less than or equal to 6 x 10’ ⁶ / °C and the specific heat capacity of the connector (1 ) is lower than 0.3 J/gK. The metals in the above list can be added into the material composition of the connector (1 ) as intentionally or as impurities.

[0039] In a more preferred embodiment of the present invention, the connector (1 ) is made of copper and tungsten, i.e. , the B is tungsten. It is to be understood that both copper and tungsten are available as in the commercial purity range that of which the connector (1 ) is made. Tungsten has the highest strength among the five refractory metals as well as highest thermal conductivity and also tungsten is a good electric conductor. Copper-tungsten (tungsten-copper, CuW, or WCu) is a mixture of copper and tungsten. As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The microstructure is therefore rather a metal matrix composite instead of a true alloy. The material combines the properties of both metals, resulting in a material that is heat- resistant, ablation-resistant, highly thermally and electrically conductive, and easy to machine. Parts are made from the CuW composite by pressing the tungsten particles into the desired shape, sintering the compacted part, then infiltrating with molten copper. Sheets, rods, and bars of the composite mixture are available as well. Commonly used copper tungsten mixtures contains 10-50 wt.% of copper, the remaining portion being mostly tungsten. The typical properties is dependent on its composition. With such embodiment, the connector (1 ) can be connected to the conductive element (4) by soldering that the heat is transferred to the solder (5) material efficiently and also that less thermal burden/stress created over the substrate (3). Furthermore, the need for a conductive coating over the connector (1 ) is further eliminated such that the connector (1 ) can be manufactured in a cost-saving manner, in addition that also provides a fix for delamination.

[0040] In another embodiment of the present invention, the connector (1 ) comprises tungsten-copper material composition which is in the form an alloy, composite or a cladded sheet; however, other metals such as but not limited to molybdenum, titanium, hafnium, tantalum, chromium, iridium, niobium, vanadium, platinum, and combinations thereof may be suitable for adding in the mixture of copper and tungsten for the connector (1 ) so long as a difference between the first coefficient of thermal expansion of the substrate (3) and the second coefficient of thermal expansion of the connector (1 ) is less than or equal to 6 x 10’ ⁶ / °C, which will be described in further detail below. The tungsten-copper material enables the connector (1 ) to reduce the mechanical stress between the connector (1 ) and the substrate (3) due to thermal expansion of the connector (1 ) and the substrate (3) resulting from changes in temperature. More specifically, the mechanical stress is caused by the differences between the first and second coefficients of thermal expansion. The mechanical stress may cause cracking or other damage to the substrate (3), and may also cause the connector (1 ) to separate from the substrate (3).

[0041] Preferably, the tungsten-copper connector (1 ) is in the form of an alloy, composite or a cladded sheet. The selection may base on the physical properties of the material such as thermal expansion coefficient and/or specific heat capacity. The thermal expansion coefficient is selected based on the difference of thermal expansion coefficients being less than or equal to 6 x 10’ ⁶ / °C of the connector (1 ) and the substrate (3). The specific heat capacity of tungsten-copper connector (1 ) is preferably in the proximity of 0.2 J/gK. The electrical and thermal conductivities of the connector (1 ) are selected preferably on the higher side of the selected compositions.

[0042] Preferably, the tungsten ratio in the tungsten-copper connector (1 ) is in the range of 50% to 90% by weight based on the total weight of the connector (1 ). In a more preferred embodiment, the tungsten ratio present in the tungsten-cooper connector (1 ) is around 70% by weight, the wording “around” or “proximity” in this context should be understood as in the range of ± 10%, even more ± 5%. The composition of tungsten-copper connector (1 ) material may be selected based on coefficient of thermal expansion close to the substrate (3) material. More specifically, the difference of coefficients of thermal expansion between the connector (1 ) and substrate (3) materials within the range of 6 x 10’ ⁶ / °C. Furthermore in specifically, the tungsten ratio in the tungsten-copper connector (1 ) may be selected depending on the nature of the intended applications as a tailor-made solution.

[0043] The present invention also proposes a pane (2) comprising a substrate (3) formed from glass and an electrically conductive element (4) provided on at least a portion of the substrate (3) and a connector (1 ) described above in detail is attached to the conductive element (4) so as to be in electrical communication with the conductive element (4). The conductive element (4) on the substrate (3) is equipped with conductive wires and/or two dimensional conductive layers. The conductive wires are placed vertically, but they can also be placed horizontally or along any other orientation over the substrate (3). [0044] In different versions of this embodiment, the substrate (3) is glass which can be made of (mineral) glass, more specifically a silica-based glass, such as soda-lime- silica, alumino-silicate or boro-silicate type glass or other types like quartz, flat or curved or float or etc.

[0045] In another versions of this embodiment, the conductive element (4)provided on the glass substrate (3) may comprise one or more of the following materials such as but not limited to C, Graphene, Ag, Au, Cu, Ni, Al, Ti, Or, Fe, V or W.

[0046] The present invention also proposes a vehicle comprising at least one pane (2) as described previously. In a preferred embodiment, the pane (2) is a windshield or a sidelite or a backlite or a roof of a vehicle or any surface where glass is utilized. The present invention also proposes a vehicle comprising at least one assembly as described previously.

[0047] The present invention also proposes the usage of an electrical connector (1 ) made of tungsten-copper as described above in detail as current/signal carrier to any electrically conductive element (4) provided on glass substrate (3) for panes (2). As described above in detail that usage of a such connector (1 ) on glass surfaces provides better thermal and electrical conductivity as well as better mechanical strength which facilities less mechanical and thermal stress on glass surface, i.e. , long lasting operation without cracking of or any other damage to glass or the electrical device (7).

[0048] The present invention also proposes the usage of a such pane (2) described above in detail in and/or for automotive or architecture or telecommunication applications. Applications of such a pane (2) is not limited to just automotive industry, the pane (2) can be used for internal and external windows of buildings and also for displays like TVs, information boards, even smartphones.

[0049] With the connector (1 ) of the present invention, a reduction of thermal stress and mechanical stress is achieved on the surface of a pane (2) comprising a substrate (3) formed from glass. The connector (1 ) of the present invention provides better heat distribution over the substrate (3) and better electrical conductivity through the conductive element (4) in addition to a close thermal expansion coefficient to the substrate (3) of the pane (2), that makes compatibility for a wide range of applications on glass surfaces. [0050] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The foregoing description details certain embodiments of the invention. It will be appreciated, however, that no matter how detailed the foregoing appears in text, the invention may be practiced in many ways.

The invention is not limited to the disclosed embodiments.