Title:
ELECTRICALLY CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2021/235431
Kind Code:
A1
Abstract:
Provided is an electrically conductive film which is configured by forming a metal film on a transparent conductive layer containing metal nanowires, wherein conductivity is less likely to be reduced even when the electrically conductive film is subjected to an etching process. This electrically conductive film comprises: a metal layer, the transparent electrically conductive layer, and a substrate, in that order. The transparent electrically conductive layer includes the metal nanowires and a polymer matrix. Some of the metal nanowires protrude from the transparent electrically conductive layer towards the metal layer side. The thickness of the transparent electrically conductive layer is 30-150 nm.
Inventors:
KONO FUMIHIKO (JP)
NAGASE JUNICHI (JP)
ANDO HIDEHIKO (JP)
NAGASE JUNICHI (JP)
ANDO HIDEHIKO (JP)
Application Number:
PCT/JP2021/018775
Publication Date:
November 25, 2021
Filing Date:
May 18, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01B5/14
Domestic Patent References:
| WO2016051695A1 | 2016-04-07 |
Foreign References:
| JP2016197554A | 2016-11-24 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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