Title:
ELECTRICALLY CONDUCTIVE FINE PARTICLES AND ANISOTROPIC ELECTRICALLY CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2006/080289
Kind Code:
A1
Abstract:
This invention provides electrically conductive fine particles and an anisotropic electrically conductive material using the electrically conductive fine particles that, even when used particularly in a plasma display panel, have low connection resistance, are large in current capacity at the time of connection, and, at the same time, can prevent migration, and, thus, can realize a high level of connection reliability. The electrically conductive fine particles are produced by heating electrically conductive fine particles, comprising copper metal particles having a surface coated with a tin plating film formed by electroless plating and a silver plating film formed thereon by electroless plating, at 240ºC or above to cause thermal metal diffusion and thus to form a ternary alloy film of tin-silver-copper. In this case, preferably, the contents of tin, silver, and copper in the composition of the ternary alloy film of tin-silver-copper are 80 to 99.8% by weight, 0.1 to 10% by weight, and 0.1 to 10% by weight, respectively. The anisotropic electrically conductive material comprises the electrically conductive fine particles dispersed in a resin binder.
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Inventors:
KUBOTA TAKASHI (JP)
Application Number:
PCT/JP2006/301013
Publication Date:
August 03, 2006
Filing Date:
January 24, 2006
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
KUBOTA TAKASHI (JP)
KUBOTA TAKASHI (JP)
International Classes:
H01B5/00; B22F1/10; B22F1/17; C22C13/00; H01B1/22; H01B5/16; H01R11/01
Foreign References:
| JP2004156062A | 2004-06-03 | |||
| JPH06346111A | 1994-12-20 | |||
| JP2004362809A | 2004-12-24 | |||
| JP2001011502A | 2001-01-16 |
Attorney, Agent or Firm:
Miyazaki, Chikara (5-4 Tanimachi 1-chome, Chuo-k, Osaka-shi Osaka, JP)
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