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Patent Searching and Data


Title:
ELECTRICALLY CONDUCTIVE MATERIAL, AND CONNECTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/029993
Kind Code:
A1
Abstract:
Provided is an electrically conductive material in which a hardened material has excellent transparency, and in which the hardened material has excellent heat resistance and is therefore resistant to discoloration. The electrically conductive material according to the present invention includes: a plurality of electrically conductive particles comprising solder on an outer surface part of an electrically conductive part; a thermosetting compound; and a thermosetting agent. The thermosetting compound includes thermosetting compounds comprising a thiirane group and a triazine skeleton.

Inventors:
KUBOTA TAKASHI (JP)
TAKAHASHI HIDEYUKI (JP)
NISHIOKA KEIZO (JP)
Application Number:
PCT/JP2016/072776
Publication Date:
February 23, 2017
Filing Date:
August 03, 2016
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; C08G75/08; H01B1/00; H01L21/60; H01R11/01; H05K3/32; H01B5/00
Domestic Patent References:
WO2014109042A12014-07-17
WO2014112541A12014-07-24
WO2015083587A12015-06-11
Foreign References:
JP2011054769A2011-03-17
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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