Title:
ELECTRICALLY CONDUCTIVE PASTE, AND WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/055848
Kind Code:
A1
Abstract:
An electrically conductive paste contains: metal nanoparticles having a mean particle diameter of 30-400 nm, protected by an organic compound containing an amino group; metal particles having a mean particle diameter of 1-5 µm, protected by a higher fatty acid; an organic solvent; and a resin component. Also, a conductor made by calcination of the electrically conductive paste has a film thickness of 30 µm or greater, and has specific resistance of 5.0 x 10–6Ω•cm or less. In this way, with the electrically conductive paste, it is possible to lower the resistance of the obtained conductor, and to increase the amount of current that flows. A wiring board is provided with the conductor obtained from the electrically conductive paste.
Inventors:
YAMADA MAKI (JP)
KATSUMATA RIE (JP)
AOYAMA YUKITO (JP)
KATSUMATA RIE (JP)
AOYAMA YUKITO (JP)
Application Number:
PCT/JP2017/021608
Publication Date:
March 29, 2018
Filing Date:
June 12, 2017
Export Citation:
Assignee:
YAZAKI CORP (JP)
International Classes:
C09C1/62; H01B1/22; C09C3/08; C09D5/24; C09D201/00; H01B1/00; H05K1/09
Domestic Patent References:
| WO2015060245A1 | 2015-04-30 | |||
| WO2016076306A1 | 2016-05-19 | |||
| WO2012133767A1 | 2012-10-04 | |||
| WO2014185073A1 | 2014-11-20 | |||
| WO2015163076A1 | 2015-10-29 |
Foreign References:
| JP2016054098A | 2016-04-14 | |||
| JP2014055332A | 2014-03-27 | |||
| JP2016069710A | 2016-05-09 | |||
| JP2012052198A | 2012-03-15 | |||
| JP2007035353A | 2007-02-08 | |||
| JP2010275580A | 2010-12-09 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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