Title:
ELECTROACOUSTIC TRANSDUCER
Document Type and Number:
WIPO Patent Application WO/2024/009658
Kind Code:
A1
Abstract:
Provided is an electroacoustic transducer which is formed by disposing a plurality of vibrators in a vibration plate, and in which sound pressure reduction in a high tone range can be suppressed and power consumption can be reduced. The present invention is provided with: a vibration plate; and a vibrator group formed of a plurality of piezoelectric vibrators disposed on one surface of the vibration plate. The plurality of piezoelectric vibrators each belong to any of a first group to an n-th group. The upper limit frequencies in the frequency bands of input signals to be inputted to the piezoelectric vibrators are different from one another for the respective groups. When the upper limit frequencies in the respective groups are defined as f1 to fn, the upper limit frequencies are reduced gradually from the upper limit frequency f1 in the first group to the upper limit frequency fn in the n-th group.
Inventors:
MIYOSHI TETSU (JP)
Application Number:
PCT/JP2023/020327
Publication Date:
January 11, 2024
Filing Date:
May 31, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H04R17/00; H04R3/14; H04R7/04
Domestic Patent References:
| WO2020179353A1 | 2020-09-10 | |||
| WO2016017632A1 | 2016-02-04 |
Foreign References:
| JP2009518922A | 2009-05-07 | |||
| JP2012134956A | 2012-07-12 | |||
| JP2016140060A | 2016-08-04 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF:
Previous Patent: MOTOR CONTROL DEVICE, MOTOR CONTROL METHOD, AND ELEVATOR DEVICE
Next Patent: SILICON WAFER AND MANUFACTURING METHOD THEREFOR
Next Patent: SILICON WAFER AND MANUFACTURING METHOD THEREFOR