Title:
ELECTROCHEMICAL DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/111168
Kind Code:
A1
Abstract:
[Problem] To provide: an electrochemical device which is reduced in the thickness to the level where the electrochemical device is able to be incorporated in a thin electronic device such as an IC card; and a method for manufacturing this electrochemical device.
[Solution] An electrochemical device which comprises: an element main body 10 wherein a pair of internal electrodes 16, 26 are laminated so as to sandwich a separator sheet 11 therebetween; an outer casing sheet 4 that covers the element main body 10; sealing parts 40, 42 that hermetically seal the peripheral part of the outer casing sheet 4 so that the element main body 10 is immersed in an electrolyte solution; and lead terminals 18, 28 that are electrically connected to the internal electrodes 16, 26 respectively and are led out from the sealing parts 40, 42 of the outer casing sheet 4 to the outside. A resin inner layer 4B that is present in the inner surface of the outer casing sheet 4 is provided with a fusion bonding part 4B1 for separators, which partially bonds a part of the separator sheet 11 to the inner surface of the outer casing sheet 4.
Inventors:
HASEGAWA HIROAKI (JP)
YOSHINO YUJI (JP)
YOSHIKAWA KAZUNORI (JP)
ITOH HIDETAKE (JP)
ANAI KAZUHIRO (JP)
OHASHI YOSHIHIKO (JP)
YOSHINO YUJI (JP)
YOSHIKAWA KAZUNORI (JP)
ITOH HIDETAKE (JP)
ANAI KAZUHIRO (JP)
OHASHI YOSHIHIKO (JP)
Application Number:
PCT/JP2016/088743
Publication Date:
June 29, 2017
Filing Date:
December 26, 2016
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G11/52; H01G11/78; H01G11/84; H01M10/04; H01M10/0585; H01M50/126; H01M50/178; H01M50/463; H01M50/548; H01M50/553
Foreign References:
| JP2010277925A | 2010-12-09 | |||
| JP2005071658A | 2005-03-17 | |||
| JP2007311323A | 2007-11-29 | |||
| JP2015173219A | 2015-10-01 | |||
| JPS58173164U | 1983-11-19 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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