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Title:
ELECTROCHEMICAL DEVICE AND PACKAGING STRUCTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2009/136660
Kind Code:
A1
Abstract:
Provided is an electrochemical device that is compatible with high temperature reflow soldering using lead‑free solder. An electrical double‑layer capacitor (10‑1) has a structure in which a positive pole terminal (12) and a negative pole terminal (13) are exposed from a package (14) in which an electric storage element (11) is sealed. The entire package (14) and the base parts of the exposed parts of the positive pole terminal (12) and the negative pole terminal (13) are covered using a thermal insulating material (16) with heat conductivity lower than that of package (14).

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Inventors:
YAWATA KAZUSHI (JP)
KOBAYASHI MOTOKI (JP)
ISHIDA KATSUEI (JP)
HAGIWARA NAOTO (JP)
Application Number:
PCT/JP2009/058958
Publication Date:
November 12, 2009
Filing Date:
May 07, 2009
Export Citation:
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Assignee:
TAIYO YUDEN KK (JP)
YAWATA KAZUSHI (JP)
KOBAYASHI MOTOKI (JP)
ISHIDA KATSUEI (JP)
HAGIWARA NAOTO (JP)
International Classes:
H01G9/08; H01G11/12; H01G11/18; H01G11/74; H01G11/76; H01G11/82; H01M10/50; H01M50/126; H01M50/143; H01M50/176
Foreign References:
JP2000286171A2000-10-13
JP2005353894A2005-12-22
JPH10172866A1998-06-26
JP2000182579A2000-06-30
JP2000200587A2000-07-18
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